TO型器件内部水汽含量一致性控制  

Consistency Control of Internal Water Vapor Content of TO-Type Devices

作　　者：颜添 姚建军 郝勇 YAN Tian;YAO Jianjun;HAO Yong(Jinan Jingheng Electronics Co.,Ltd.,Jinan 250300,China)

机构地区：[1]济南晶恒电子有限责任公司,济南250300

出　　处：《电子与封装》2024年第10期47-50,共4页Electronics & Packaging

摘　　要：采用铅锡银焊料烧结的TO型器件在相同平行缝焊工艺下的内部水汽含量一致性出现了差异,部分器件的水汽含量甚至超标。筛选后的器件腔体内存在氢气和氧气,气体在反偏或老炼等高温条件下发生了化学反应,生成了水汽,从而导致水汽含量超标。通过对外壳和盖板进行脱氢处理,可以大幅度降低密封后腔体内氢气释放量,减少水汽的生成,达到提高TO型器件内部水汽含量一致性的目的。该方法可以为采用铅锡银等焊料烧结的TO型器件内部水汽含量控制提供一种技术途径。The consistency of the internal water vapor content of TO-type devices sintered with lead-tin-silver solder under the same parallel seam soldering process shows differences,and the water vapor content of some devices even exceeds the standard.Hydrogen and oxygen are present in the cavity of the screened device,and the gases undergo a chemical reaction under high temperature conditions such as reverse bias or aging,generating water vapor,and resulting in excessive water vapor content.By dehydrogenating the shell and cover plate,the hydrogen released in the sealed cavity can be significantly reduced,and the generation of water vapor can be reduced,so as to achieve the purpose of improving the consistency of water vapor content in the TO-type devices.This method can provide a technical way for controlling internal water vapor content of TO-type devices sintered with solders such as lead-tin-silver solder.

关 键 词：TO型 内部水汽含量 脱氢处理 铅锡银焊料 

分 类 号：TN305.94[电子电信—物理电子学]