无助焊剂甲酸回流技术在铜柱凸点回流焊中的应用  

Application of Flux-Free Formic Acid Reflow Technology in Copper Pillar Bump Reflow Soldering

作　　者：刘冰 LIU Bing(Guizhou Zhenhua Fengguang Semiconductor Co.,Ltd.,Guiyang 550018,China)

机构地区：[1]贵州振华风光半导体股份有限公司,贵阳550018

出　　处：《电子与封装》2024年第10期98-105,共8页Electronics & Packaging

摘　　要：摩尔定律放缓,先进制程逼近物理极限,先进封装朝连接密集化、堆叠多样化和功能系统化方向发展,这一趋势使得铜柱凸点互连可靠性更具挑战性。回流焊是形成铜柱凸点的关键工艺,回流后凸点质量对于互连可靠性至关重要。对传统助焊剂回流用于铜柱凸点回流焊的劣势进行了简要阐述,综述了甲酸回流技术用于铜柱凸点回流焊的可行性,重点从还原效果、焊料润湿性、清洁性方面进行评述。概述了甲酸回流技术的原理和工艺流程,总结了其相较于助焊剂回流技术在产品质量、成本等方面的优势,并介绍了当下处于研究阶段的2种新型无助焊剂回流技术,展望了回流技术的未来发展趋势。As Moore's Law slows down,advanced processes approach their physical limits,and advanced packaging develops in the direction of connection densification,stacking diversification and functional systematization,making the reliability of copper pillar bump interconnection face greater challenges.Reflow soldering is a critical process for the formation of copper pillar bumps,and the quality of the bumps after reflow is critical to the reliability of the interconnection.The disadvantages of traditional flux reflow for copper pillar bump reflow soldering are briefly described,and the feasibility of formic acid reflow technology for copper pillar bump reflow soldering is summarized,focusing on the reduction effect,solder wettability and cleanliness.The principle and process flow of formic acid reflow technology are outlined,and its advantages compared with flux reflow technology in terms of product quality and cost are summarized.Two new fluxless reflow technologies in the research stage are introduced,and the future development trend of reflow technology is prospected.

关 键 词：先进封装 铜柱凸点 无助焊剂回流 甲酸回流技术 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]