过氧化氢-硫酸体系铜箔微蚀工艺及其稳定剂筛选  

Miro-etching of copper foil in hydrogen peroxide-sulfuric acid solution and selection of corresponding stabilizer

作　　者：曾祥健 袁振杰 周仲鑫 潘湛昌[1] 胡光辉[1] 周勇胜 邓贤江 ZENG Xiangjian;YUAN Zhenjie;ZHOU Zhongxin;PAN Zhanchang;HU Guanghui;ZHOU Yongsheng;DENG Xianjiang(School of Chemical Engineering and Light Industry,Guangdong University of Technology,Guangzhou 510006,China;Dongguan Hong Yuen Electronics Co.,Ltd.,Dongguan 523932,China)

机构地区：[1]广东工业大学轻工化工学院,广东广州510006 [2]东莞康源电子有限公司,广东东莞523932

出　　处：《电镀与涂饰》2024年第10期56-63,共8页Electroplating & Finishing

摘　　要：[目的]过氧化氢-硫酸体系用于PCB(印制线路板)微蚀时存在过氧化氢易分解和微蚀速率过高的问题,研发适宜的稳定剂具有重要的意义。[方法]采用由过氧化氢、硫酸和铜离子组成的溶液对铜箔进行微蚀。先通过研究温度和各组分质量浓度对微蚀速率的影响以确定微蚀液的基础成分,然后设计了一系列不同组合的复配稳定剂,以获得适用于不同工艺需求的微蚀液。[结果]较佳的微蚀基础配方和工艺条件为:浓硫酸140 g/L,双氧水110 g/L,铜离子25 g/L,温度30℃,时间1 min。可选择以四羟丙基乙二胺(EDTP)和乙二胺四乙酸二钠(EDTA-2Na)为主成分,并适当添加磷酸二氢铵(DAP)、N-甲基二乙醇胺(DMEA)、2-氨基-2-甲基-1-丙醇(AMP)、三乙醇胺(TEA)、2-甲基咪唑(2-MI)和1,6-乙二醇(HDO)中的一种或多种作为辅助成分的复配稳定剂。[结论]本研究所得铜箔微蚀工艺具有微蚀速率及铜箔表面粗糙度、形貌可控的优点,能够满足不同的生产需求。[Introduction]The hydrogen peroxide-sulfuric acid solution used for micro-etching of PCB(printed circuit board)faces some issues such as easy decomposition of hydrogen peroxide and excessively high etching rates.It is greatly significant to develop suitable corresponding stabilizers.[Method]The copper foil was micro-etched in a solution composed of hydrogen peroxide,sulfuric acid,and copper ions.The basic composition of etching solution was determined by studying the effects of temperature and mass concentration of each component on the etching rate.A series of compound stabilizers with different contents were designed to obtain the suitable micro-etching solutions for different requirements.[Result]The basic composition of micro-etching solution and process conditions were optimized as follows:concentrated sulfuric acid 140 g/L,hydrogen peroxide 110 g/L,copper ion 25 g/L,temperature 30℃,and time 1 min.A composite stabilizer with tetrahydroxypropyl ethylenediamine(EDTP)and disodium ethylene-diaminetetraacetate(EDTA-2Na)as the primary components,and an appropriate addition of one or more auxiliary components i.e.ammonium dihydrogen phosphate(DAP),N-methyldiethanolamine(DMEA),2-amino-2-methyl-1-propanol(AMP),triethanolamine(TEA),2-methylimidazole(2-MI),and 1,6-hexanediol(HDO)can be selected.[Conclusion]The micro-etching process of copper foil obtained in this paper has the advantages of controllable etching rate,surface roughness,and surface morphology,meeting various production requirements.

关 键 词：印制线路板 铜箔 微蚀 过氧化氢 硫酸 稳定剂 

分 类 号：TQ153.6[化学工程—电化学工业]