不同镀膜方法对铜爆炸箔电爆炸性能及成本的影响  

Effect of Different Coating Methods on the Electric Explosive Performance and Cost of Copper Explosive Foils

作　　者：杨德宇 徐聪 陈航 王瀚涛 代波 任勇 YANG De-yu;XU Cong;CHEN Hang;WANG Han-tao;DAI Bo;REN Yong(State Key Laboratory of Environment-friendly Energy Materials,Southwest University of Science and Technology,Mianyang,621010;National Defense Science and Technology Institute,Southwest University of Science and Technology,Mianyang,621010)

机构地区：[1]西南科技大学环境友好能源材料国家重点实验室,四川绵阳621010 [2]西南科技大学国防科技学院,四川绵阳621010

出　　处：《火工品》2024年第5期78-83,共6页Initiators & Pyrotechnics

基　　金：四川省科技计划杰出青年科学基金项目(2024NSFJQ0064)。

摘　　要：为满足不同应用场景对爆炸箔电爆炸性能和成本的要求,对比研究了磁控溅射法、电子束蒸发法和电镀法3种不同镀膜技术制备的铜爆炸箔。通过X射线衍射(XRD)、扫描电子显微镜(SEM)和原子力显微镜(AFM)对爆炸箔的物相和微观结构进行了表征,同时分析不同制备方法对电阻和电爆炸性能的影响。研究表明:3种方法均能制备出纯相铜薄膜,且都有较好的结晶度。电爆炸试验结果显示:2 000 V时,磁控溅射法制备的爆炸箔爆发功率分别是电子束蒸发法和电镀法的1.24倍和4.05倍。成本分析表明:磁控溅射法由于对设备和材料的要求高,成本最高;电子束蒸发法次之,而电镀法成本最低。综合考虑性能和成本,建议航空航天采用磁控溅射法,武器弹药采用电子束蒸发法,民用爆破采用电镀法。In order to meet the requirements of electric explosive performance and cost of explosive foil,copper explosive foils prepared by magnetron sputtering,electron beam evaporation and electroplating methods were studied.The phase and microstructure of the explosive foils were characterized by X-ray diffraction(XRD),scanning electron microscope(SEM)and atomic force microscope(AFM),and the effects on resistance and electric explosive performance by different preparation methods were analyzed.The results indicate that all three methods can produce pure-phase copper films with good crystallinity.The electric explosion tests reveal that at a voltage of 2000 V,the burst power of the explosive foil prepared by magnetron sputtering is 1.24 times and 4.05 times that of those prepared by electron beam evaporation and electroplating,respectively.Cost analysis shows that magnetron sputtering,due to its high equipment and material requirements,has the highest cost;electron beam evaporation method is the next most costly,and electroplating method has the lowest cost.Considering both performance and cost,it is recommended that the aerospace field should use magnetron sputtering,the armaments field should use electron beam evaporation,and the general civil blasting field should use electroplating.

关 键 词：爆炸箔 磁控溅射 电子束蒸发 电镀 电爆炸性能 成本 

分 类 号：TJ450.3[兵器科学与技术—火炮、自动武器与弹药工程]