产教研协同育人模式下电子封装专业教学改革实践与探索  

作　　者：陈宏涛 刘加豪 邱业君 钟颖 刘海星 李明雨 

机构地区：[1]哈尔滨工业大学(深圳)集成电路学院,广东深圳518055 [2]工业和信息化部电子第五研究所,广州511370

出　　处：《高教学刊》2024年第33期135-138,共4页Journal of Higher Education

基　　金：2022年度广东省省级质量工程项目“哈尔滨工业大学(深圳)—深圳赛意法微电子有限公司科产教融合实践教学基地”(HITSZERP22001)。

摘　　要：针对不断发展的电子封装新技术以及新业态,“产教研协同发展、培养应用型复合人才”成为高校电子封装专业教学改革的新模式。该文以哈尔滨工业大学(深圳)电子封装专业产教研改革实践为例,提出包括企业名师讲座、校企联合实训、多方合作攻关和产学协同科研转化等产教研协同育人的若干举措,着力提升学生解决电子封装工程实际问题的综合能力,为培养高层次应用型复合科技人才提供借鉴。Targeting the constantly evolving new technologies and business models of electronic packaging,the collaborative development of industry,universities,and research institutes(IUR)to cultivate applied comprehensive talents has become a new mode of teaching reform in the field of electronic packaging.Taking the IUR reform of electronic packaging major at Harbin Institute of Technology,Shenzhen as an example,the new model proposes several measures for the collaborative education of IUR,including lectures by enterprise renowned teachers,joint training between schools and enterprises,multi-party cooperation in tackling key issues,and collaborative research transformation between industry and academia.The aim is to enhance students'comprehensive ability to solve practical problems in electronic packaging engineering and provide reference for cultivating high-levell applied comprehensive talents.

关 键 词：电子封装 教学改革 人才教育 应用型复合人才 校企联合 

分 类 号：G420[文化科学—课程与教学论]