四氢噻唑硫酮对锂电铜箔抗拉强度影响分析  

Influence of Terahydrozolinethioketone on Tensile Strength of Electrolyte Copper Foil

作　　者：付争兵 陈星 童凯文 王伟 FU Zhengbing;CHEN Xing;TONG Kaiwen;WANG Wei(Jiangxi Xinborui Technology Co.,Ltd.,Yingtan 335000,China)

机构地区：[1]江西鑫铂瑞科技股份有限公司,江西鹰潭335000

出　　处：《铜业工程》2024年第5期21-26,共6页Copper Engineering

基　　金：江西省鹰潭市学科带头人资助计划项目(20233-205952)资助。

摘　　要：高抗拉强度铜箔能满足高能量密度电池的辊压生产工艺要求。在正常生产6μm超薄铜箔的添加剂中加入光亮剂四氢噻唑硫酮,测试所得铜箔的光泽度、抗拉强度和粗糙度等物理性能,并对铜箔进行X射线衍射(XRD)、扫描电镜(SEM)和3D超景深测试分析。当四氢噻唑硫酮添加量为原配方中光亮剂聚二硫二丙烷磺酸钠质量的10%时,得到的铜箔抗拉强度最高,达到420 MPa。四氢噻唑硫酮中含有不饱和双键和N原子,吸附在阴极辊表面后,强大的负电场对p电子产生排斥作用,使电子给予体S,N原子能力加强,具有sp^(3)杂化空轨道的Cu^(2+)与之接触时,生成稳定络合物,铜箔抗拉强度提高。High tensile strength copper foil can match the rolling process of high-energy density batteries.Terahydrozolinethioketone was added into the additive for producing 6μm copper foil.The brightness,glossines,tensile strength and roughness of copper foil were tested.XRD,SEM and 3D Superdepth of field were utilized to analyse the copper foils.The highest tensile strength of copper foil was produced when the amount of terahydrozolinethioketone was 10%of the mass ratio of bis-(sodium sulfopropyl)-disulfide in the original formula,the tensile strength could reach 420 MPa.After being adsorbed on the surface of the cathode roller,unsaturated double bonds and N atoms,p-electrons were repelled by strong negative electric field,which made the ability of the S and N atoms improved.Stable complex were formed when Cu^(2+)with sp^(3) hybrid empty orbitals migrated to the electrode surface,the tensile strength of the copper foil was improved.

关 键 词：铜箔 电解铜箔 抗拉强度 光亮剂 络合物 

分 类 号：TG146.1[一般工业技术—材料科学与工程]