混合集成电路用环氧粘接胶外渗机理及控制  

Mechanism and Control of Epoxy Adhesive Exosmosis for Hybrid Integrated Circuits

作　　者：蒲航 弓明杰 史海林 任思雨 韩可 周永刚 PU Hang;GONG Mingjie;SHI Hailin;REN Siyu;HAN Ke;ZHOU Yonggang(Xi'an University of Technology,Xi’an 710048,China)

机构地区：[1]西安理工大学,西安710048

出　　处：《电子工艺技术》2024年第6期42-45,共4页Electronics Process Technology

摘　　要：环氧树脂粘接剂综合性能优异,在混合集成电路中使用广泛。针对环氧树脂粘接剂在混合集成电路用厚膜陶瓷基板上的外渗机理进行研究,结果发现助焊剂中的表面活性剂和等离子清洗会引起环氧树脂粘接剂在厚膜陶瓷基板表面过度润湿,导致环氧树脂粘接剂中的活性稀释剂脱离胶体造成外渗。对于环氧树脂粘接剂的外渗问题,提出了介质隔离、真空烘烤、调整等离子清洗参数的解决方法。Epoxy resin adhesive has excellent comprehensive properties and is widely used in hybrid integrated circuits.The exosmosis mechanism of epoxy resin adhesives on thick film ceramic substrates used in mixed integrated circuits is studied.The results showed that the surfactant and plasma cleaning in the flux would cause excessive wetting of the epoxy resin adhesives on the surface of thick film ceramic substrates,resulting in the active thinner in the epoxy resin adhesives breaking away from the colloid and causing exosmosis.To solve the problem of exosmosis of epoxy resin adhesives,the methods such as dielectric isolation,vacuum baking and adjusting plasma cleaning parameters are put forward.

关 键 词：混合集成电路 环氧粘接剂 陶瓷基板 外渗 表面能 

分 类 号：TN405[电子电信—微电子学与固体电子学]