化学镀铜影响镀层光亮性的因素研究  

A Study on the Factors Influencing the Brightness of Electroless Copper Plating

作　　者：韦家亮 Wei Jialiang(Shenzhen BYD Automotive Industry Co.,Ltd.Shenzhen 518118)

机构地区：[1]深圳市比亚迪汽车工业有限公司,广东深圳518118

出　　处：《五金科技》2024年第6期80-83,共4页Hardware

摘　　要：本文研究了化学镀铜工艺中影响光亮性的关键因素。通过实验分析和理论探讨,确定了络合剂种类以及浓度,添加剂的种类浓度、操作条件、表面活性剂的种类和浓度,化学镀铜反应副产物的累积,污染物的累积等因素对镀层光亮性有较大的影响。This article studies the key factors affecting the brightness in the chemical copper plating process.Through experimental analysis and theoretical exploration,factors such as the type and concentration of complexing agents,the type and concentration of additives,operating conditions,the type and concentration of surfactants,the accumulation of by-products from the chemical copper plating reaction,and the accumulation of pollutants have a significant impact on the brightness of the coating.

关 键 词：化学镀铜 光亮性 添加剂 操作条件 络合剂 表面活性剂 副产物 铜粉和一价铜 还原剂 

分 类 号：TG178[金属学及工艺—金属表面处理]