PTFE材料组合激光加工盲孔工艺  

Study on the technology of PTFE material laser processing blind holes

作　　者：王红月 孙宜勇 周明巧 WANG Hongyue;SUN Yiyong;ZHOU Mingqiao(Shanghai Meadville Electronics Company Limited,Shanghai 201100,China)

机构地区：[1]上海美维电子有限公司,上海201100

出　　处：《印制电路信息》2024年第12期10-16,共7页Printed Circuit Information

摘　　要：在汽车市场中,聚四氟乙烯(PTFE)树脂类基板材料已成为车载毫米波雷达印制电路板(PCB)产品制造的主流选择。采用CO_(2)+紫外线(UV)激光非一体机组合激光技术,对一款PTFE材料进行盲孔加工处理,探究该工艺的加工效果。结果表明,采用非一体组合激光加工技术生产的最大对位偏差为30μm,可通过UV激光路径设计的孔径进行补偿,有效校正偏差,确保激光路径完全覆盖孔底;采用UV激光螺旋填充模式加工,可解决采用单一CO_(2)激光加工生成孔底碳化物残留的问题,可靠性表现优异。Polytetrafluoroethylene(PTFE)resin substrate material,have become the mainstream choice for on-board millimeter-wave radar PCB products in the market.In this paper,the blind hole processing technology of a PTFE material using CO_(2)+UV non-integrated laser is discussed.The results show that the maximum alignment deviation of non-integrated laser machining is 30μm,which can be corrected by the aperture compensation of UV laser path design to ensure that the path completely covers the hole bottom;the spiral filling pattern of UV laser can solve the problem of carbide residue at the bottom of the hole processed by a single CO_(2) laser.The reliability of this technology is excellent.

关 键 词：聚四氟乙烯 毫米波雷达 组合激光 盲孔 

分 类 号：TN41[电子电信—微电子学与固体电子学]