先进热压键合工艺及其设备研究  

Research on Advanced Thermal Compression Bonding Process and Its Equipment

作　　者：郑嘉瑞 肖君军 ZHENG Jiarui;XIAO Junjun(Shenzhen Liande Automation Equipment Co.,Ltd.,Shenzhen 518109,China;Harbin Institute of Technology(shenzhen),School of Electronics and Information Engineering,Shenzhen 518055,China)

机构地区：[1]深圳市联得自动化装备股份有限公司,广东深圳518109 [2]哈尔滨工业大学(深圳)电子与信息工程学院,广东深圳518055

出　　处：《电子工业专用设备》2024年第6期1-6,62,共7页Equipment for Electronic Products Manufacturing

摘　　要：介绍了半导体先进封装和芯片键合技术,针对高带宽内存产品封装,重点介绍了热压键合工艺及其设备,对发展趋势进行了简要分析。Semiconductor advanced packaging and die bonding technology are introduced,mainly introducing the thermal compression bonding process and its equipment for HBM,and also the development tendency is analyzed.

关 键 词：半导体 先进封装 热压键合 设备 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]