可嵌入式金属化玻璃基微流道热沉设计与优化  

Design and optimization of embeddable metallized glass-based microchannel heat sink

作　　者：朱勇[1] 陈力嘉 赵强 ZHU Yong;CHEN Lijia;ZHAO Qiang(Southwest China Institute of Electronic Technology,Chengdu610036,China;School of Materials and Energy,University of Electronic Science and Technology of China,Chengdu611731,China)

机构地区：[1]西南电子技术研究所,四川成都610036 [2]电子科技大学材料与能源学院,四川成都611731

出　　处：《电子元件与材料》2024年第10期1235-1240,共6页Electronic Components And Materials

摘　　要：随着玻璃封装技术的迅速发展,其在高效热管理方面的短板已日益凸显,成为亟需突破的关键技术瓶颈。提出将金属化策略应用于玻璃基微流道热沉,以改善热导性能。基于分区金属化的优化设计,进一步提升局部散热效果。构建了金属化玻璃和微流道热沉模型,开展了热仿真,分析了金属化玻璃和微流道热沉的导热/散热能力,实现了金属化玻璃基微流道热沉散热能力的提升。研究结果表明,基于高热导率金属化玻璃设计的玻璃基微流道热沉能将玻璃微流道热沉的热阻由11.71W/K降低至1.80W/K,表现出明显增强的散热能力,为玻璃封装技术的热管理提供了新思路。With the rapid advancement of glass encapsulation technology,its limitations in thermal management have become increasingly evident,presenting a critical technical bottleneck in need of urgent resolution.This study explored the integration of metallization strategies into glass-based microchannel heat sinks to enhance thermal conductivity.An optimized partitioned metallization design was proposed to improve localized cooling performance further.A metallized glass microchannel heat sink model was developed,and thermal simulations were conducted to evaluate its thermal conductivity and dissipation efficiency.Results indicate that incorporating high-thermal-conductivity metallized glass into the microchannel heat sink reduces thermal resistance from 11.71W/K to 1.80W/K.This significant improvement highlights the potential of this approach as a novel solution for thermal management in glass packaging technology.

关 键 词：玻璃封装 金属化 散热 微流道热沉 嵌入式 

分 类 号：TN305.94[电子电信—物理电子学]