搬运机器人运动规划与硅片校准技术研究  

Research on motion planning and silicon wafer calibration technology of handling robots

作　　者：李昱辉 赵明 LI Yuhui;ZHAO Ming(Yantai Vocational College,Yantai 264000,Shandong China;Harbin GuangSha College,Haerbin 150000,China)

机构地区：[1]烟台职业学院,山东烟台264000 [2]哈尔滨广厦学院,黑龙江哈尔滨150000

出　　处：《粘接》2024年第12期102-104,108,共4页Adhesion

基　　金：烟台职业学院校本课题(项目编号:2022XBYB006);烟台职业学院横向课题(项目编号:HX2023047)。

摘　　要：为提高机器人的传输和操作效率,研究旨在探讨半导体搬运机器人运动规划与硅片校准算法。对半导体晶圆搬运机器人的机械本体和软件架构进行了分析,介绍了实验平台。针对半导体机器人的运动问题进行了正反运动学解耦分析,利用S型规划方法对本体进行运动规划,同时解决了机器人轨迹规划中连续轨迹的问题。对搬运的硅片进行了位姿的标定和纠偏校准。通过实验验证了半导体搬运机器人运动控制与硅片校准算法的可行性和有效性,并证明其符合机器人实际运动性能。In order to improve the transmission and operation efficiency of the robot,the purpose of this study is to explore the motion planning and silicon wafer calibration algorithm of the semiconductor handling robot.The mechanical ontology and software architecture of semiconductor wafer transport robot were analyzed,and the experimental platform was introduced.The forward and backward kinematics decoupling analysis was carried out for the motion problem of the semiconductor robot,and the S-shaped programming method was used to plan the motion of the ontology,and the problem of continuous trajectories in robot trajectory planning was solved.In addition,the position and correction calibration of the transported silicon wafers were carried out.The feasibility and effectiveness of the motion control and wafer calibration algorithm of the semiconductor handling robot were verified by experiments,and it has been proved that it is in line with the actual motion performance of the robot.

关 键 词：集成电路 搬运机器人 运动控制 硅片校准算法 

分 类 号：TQ264.1[化学工程—有机化工] TP242[自动化与计算机技术—检测技术与自动化装置]