基于田口法的高热可靠性DFN封装最优结构参数仿真研究  

Simulation Study on Optimal Structural Parameters of High Thermal Reliability DFN Package Based on Taguchi Method

作　　者：庞瑞阳 吴洁 王磊[1] 邢卫兵 蔡志匡[1] PANG Ruiyang;WU Jie;WANG Lei;XING Weibing;CAI Zhikuang(College of Integrated Circuit Science and Engineering,Nanjing University of Posts and Telecommunications,Nanjing 210023,China;Tongfu Microelectronics Co.,Ltd.,Nantong 226004,China)

机构地区：[1]南京邮电大学集成电路科学与工程学院,南京210023 [2]通富微电子股份有限公司,江苏南通226004

出　　处：《电子与封装》2024年第12期32-37,共6页Electronics & Packaging

基　　金：国家自然科学基金青年项目(52105369,52205436);江苏省先进集成电路封装与测试工程研究中心开放项目(NTIKFJJ202303,NTIKFJJ202302)。

摘　　要：随着电子技术的不断发展,芯片越来越向系统级封装方向发展,封装行业迎来了新的挑战和机遇。封装能为芯片提供机械支撑、电气连接与散热,因此其可靠性研究备受关注。双平面无铅(DFN)封装是一种无引线的表面贴装封装技术,不合理的材料组合或结构设计会导致翘曲或应力集中现象,直接影响封装体的共面度及可靠性,引发芯片断裂、焊接分层等问题。针对典型DFN封装结构,采用有限元仿真分析方法,研究特定封装产品在回流焊后以及热循环载荷下关键部位的翘曲和应力。采用田口法对DFN封装设计参数进行评估与优化,获取最优结构参数组合,将其与实际产品仿真结果进行对比,验证了仿真模型的合理性,为高可靠性DFN封装的实际生产提供了理论指导。With the continuous development of electronic technology,chips are increasingly developing towards the direction of system-level package,and the package industry has ushered in new challenges and opportunities.Package can provide mechanical support,electrical connection and heat dissipation for the chip,so its reliability research has attracted much attention.Dual flat no-lead(DFN)package is a leadless surface mount package technology.Unreasonable material combination or structural design can lead to warpage or stress concentration,which directly affects the coplanarity and reliability of the package,causing problems such as chip fracture and solder delamination.For typical DFN package structures,the warpage and stress of key parts of specific package products after reflow soldering and under thermal cycling loads are studied by finite element simulation.The DFN package design parameters are evaluated and optimized by Taguchi method to obtain the optimal combination of structural parameters.The optimal structural parameter combinations are compared with the actual product simulation results,the rationality of the simulation model is verified,and the theoretical guidance is provided for the actual production of high-reliability DFN package.

关 键 词：DFN封装 翘曲 田口法优化 有限元仿真 

分 类 号：TN305.94[电子电信—物理电子学]