基于原子力显微镜的三维表面多参数检测技术  

Three-dimensional multi-parametric surface detection technology based on atomic force microscopy

作　　者：耿俊媛 张号 孟祥和 谢晖[2] 赵新[1] GENG JunYuan;ZHANG Hao;MENG XiangHe;XIE Hui;ZHAO Xin(Institute of Robotics and Automatic Information System and the Tianjin Key Laboratory of Intelligent Robotic,Nankai University,Tianjin 300350,China;The State Key Laboratory of Robotics and Systems,Harbin Institute of Technology,Harbin 150080,China)

机构地区：[1]南开大学机器人与信息自动化研究所&天津市智能机器人技术重点实验室,天津300350 [2]哈尔滨工业大学机器人技术与系统国家重点实验室,哈尔滨150080

出　　处：《中国科学：技术科学》2024年第12期2221-2254,共34页Scientia Sinica(Technologica)

基　　金：国家自然科学基金项目(批准号:62027812,62333012,61925304,62403257)资助。

摘　　要：三维微纳电子器件因其结构紧凑、功能密度高等特点,逐渐成为主流的半导体元件形式,实现三维微纳表面多参数量化分析是控制三维器件功能质量的关键.原子力显微镜具备高分辨率力反馈成像能力,是实现微纳表面形貌、电学和力学特性同步检测的重要工具.本文综述了基于原子力显微镜的三维表面多参数检测技术,首先介绍了原子力显微镜微纳表面形貌、电势和力学特性检测原理;随后归纳了近年来基于原子力显微镜的三维表面形貌测量方法,讨论了各类三维表面形貌检测技术的优缺点,并总结了当下已开发的三维表面电势表征方法和三维表面纳米力学特性表征方法,分析了三维表面电学与力学特性测量的必要性.最后,对三维表面多参数检测技术的发展方向及其所面临的挑战进行了展望和简要概括.本文所概述的原子力显微镜三维表面多参数检测方法将为推动三维微纳电子器件功能机理问题研究提供强大的技术支持.Three-dimensional(3D)micro-nano electronic devices are gradually becoming the mainstream semiconductor component,due to their excellent compact structure and high functional density.3D multi-parametric surface detection with quantitative analysis is especially critical to the functional quality control of these 3D micro-nano devices.As a practical detection instrument,atomic force microscopy(AFM)can realize high-resolution imaging of micro-nano surface morphology,electrical and mechanical properties through tip-sample interaction force feedback.This review summarizes the 3D multi-parametric surface detection technology based on AFM.Firstly,the AFM measurement principles of surface topography,surface potential,and surface nanomechanical properties are introduced.And then,AFM-based 3D surface topography measurement methods are demonstrated,the advantages and limitations of which are discussed simultaneously.In addition,current 3D surface potential and 3D surface nanomechanical properties mapping methods are described.The necessity of 3D surface electrical and mechanical properties detection,and the limitations of current 3D surface detection methods are analyzed.Finally,the development and challenges of 3D multi-parametric surface detection technology based on AFM in the future are prospected and briefly reported,respectively.The AFM-based 3D multi-parametric surface detection technology outlined in this paper will provide powerful technical support for promoting the functional mechanism research of 3D micro-nano electronic devices.

关 键 词：三维微纳电子器件 原子力显微镜 三维表面形貌 三维表面电势 三维表面纳米力学特性 

分 类 号：TH742[机械工程—光学工程]