金铝键合界面行为分析与寿命模型研究  

Behavior Analysis and Lifetime Model Study of Gold-Aluminum Bonding Interfaces

作　　者：张浩 周伟洁 李靖 ZHANG Hao;ZHOU Weijie;LI Jing(Wuxi Zhongwei High-Tech Electronics Co.,Ltd.,Wuxi 214035,China)

机构地区：[1]无锡中微高科电子有限公司,江苏无锡214035

出　　处：《电子与封装》2025年第1期1-6,共6页Electronics & Packaging

摘　　要：随着电子封装技术的飞速发展,金铝键合工艺作为一种重要的金属间连接方式,在电子器件的制造过程中得到了广泛的应用。然而,在高温环境下,金铝键合界面的寿命会出现退化现象,直接影响整个电子系统的稳定性和寿命。设计不同温度下的高温加速寿命试验,对比分析不同时间条件下的金铝键合界面行为,研究金铝键合焊点的机械性能退化规律。同时,利用Arrhenius模型构建了金铝键合焊点的特征寿命与绝对温度的寿命应力模型,并根据寿命应力模型分别预测了焊点在非工作状态与工作状态下的特征寿命。With the rapid development of electronic packaging technology,as an important metal to metal connection method,gold-aluminum bonding process has been widely used in the manufacturing process of electronic devices.However,the lifetime of the gold-aluminum bonding interfaces is degraded in high temperature environments,which directly affects the stability and lifetime of the entire electronic system.High temperature accelerated lifetime tests at different temperatures are designed,and the bonding interface behavior of gold-aluminum bonding at different time conditions is compared and analyzed,the degradation law of mechanical properties of gold-aluminum bonding solder joints is studied.At the same time,the lifetime stress model of the characteristic lifetime and absolute temperature of the gold-aluminum bonding solder joint is constructed by using the Arrhenius model,and the characteristic lifetimes of solder joints in the non-operating state and operating state are predicted according to the lifetime stress model respectively.

关 键 词：封装技术 金铝键合 高温加速寿命试验 寿命模型 

分 类 号：TN305.94[电子电信—物理电子学]