应用于射频前端的高密度互连多层板设计  

Design of High Density Interconnected RF Multilayer Board for RF Receiving Front-End

作　　者：钱捷[1] 沈飘飘 QIAN Jie;SHEN Piao-piao(No.36 Research Institute of CETC,Jiaxing,Zhejiang 314033,China)

机构地区：[1]中国电子科技集团公司第三十六研究所,浙江嘉兴314033

出　　处：《通信对抗》2024年第2期45-49,共5页Communication Countermeasures

摘　　要：基于射频多层板设计,采用高密度互连印制板、三维系统级封装(SIP)和低温共烧陶瓷(LTCC)滤波器等设计工艺,并通过仿真进行优化和分析,进一步实现宽带多通道超外差前端的小型化设计和应用。同时在电路和结构设计过程中进行优化改进,使射频前端组件具有很好的电磁兼容性(EMC)。在不影响接收机系统的灵敏度、动态范围等核心指标的前提下,最终实现的两次变频宽带接收组件外形尺寸为120mm×40mm×12mm,等效输入大于-110dBm的无信号杂散点数量不多于3个。Based on the design of the RF multilayer board,high density interconnected printed boards,3D sys-tem in package(SIP),and low temperature co-firing ceramic(LTCC)filter process are used to miniaturize the design and application of broadband multichannel super-heterodyne front-end.And this paper optimizes and analyzes through simulation to further achieve miniaturization the design and application.Meanwhile,optimiza-tion and improvement are carried out in the circuit and structural design process to ensure that the RF front-end component have good electromagnetic compatibility(EMC).On the premise of not affecting the core in-dicators such as sensitivity and dynamic range of the receiver system,the final size of the two frequency conver-sion broadband receiving component is 60mmx50mm×12mm,and the number of non-signal scattered points with equivalent input≥-110dbm is≤3.

关 键 词：多通道超外差接收前端 宽带 射频多层板 高密度互连 三维 系统级封装 

分 类 号：TN7[电子电信—电路与系统]