多层瓷介电容三种典型失效模式的分析  

Analysis of Three Typical Failure Modes of Multilayer Ceramic Capacitors

作　　者：李泱 吴墨 郭焕焕 王宇[1] LI Yang;WU Mo;GUO Huanhuan;WANG Yu(China Academy of Launch Vehicle Technology,Beijing 100076,China)

机构地区：[1]中国运载火箭技术研究院,北京100076

出　　处：《集成电路应用》2024年第9期6-7,共2页Application of IC

摘　　要：阐述为提升器件使用可靠性,分析多层瓷介电容的结构,结合介质空洞、电极结瘤、分层、端电极与电介质裂纹、过电应力等失效机理,在短路、断路、参数漂移方面分别进行探讨。This paper describes the analysis of the structure of multi-layer ceramic capacitors in order to improve the reliability of device use.Combining the failure mechanisms such as dielectric voids,electrode nodules,delamination,end electrode and dielectric cracks,and overpotential stress,it explores the aspects of short circuit,open circuit,and parameter drift.

关 键 词：多层瓷介电容 短路 开路 参数漂移 

分 类 号：TM534[电气工程—电器]