预涂覆焊片助焊剂含量对焊点铺展和空洞率的影响研究  

Study on the Influence of Flux Content on Spreading and Void Rate of Pre Coated Solder Pads

作　　者：万伟超 闵照友 郭绍雄 何欢 柳丽敏 秦俊虎 赵天宇 WAN Weichao;MIN Zhaoyou;GUO Shaoxiong;HE Huan;LIU Limin;QIN Junhu;ZHAO Tianyu(Yunnan Tin New Materials Co.,Ltd.,Kunming 650217,China)

机构地区：[1]云南锡业新材料有限公司,云南昆明650217

出　　处：《云南化工》2025年第2期48-51,共4页Yunnan Chemical Technology

基　　金：云南省科技厅重大专项(202302AB080013)。

摘　　要：配制了不同浓度液体助焊剂,将助焊剂分别浸涂于锡银铜合金焊片表面并用烘箱烘干,用加热台回流焊接后,测试焊点铺展和空洞率,分析助焊剂不同用量对焊点扩展率和空洞率的影响,筛选出合适的助焊剂浸涂量。实验结果表明:助焊剂重量占浸涂型焊片质量的2.5%时,焊点铺展面积较大,空洞率最小为6.1%,残留物适中,其焊接效果最佳。Different concentrations of liquid flux were prepared,and the flux was dipped onto the surface of tin silver copper alloy solder pads and dried in an oven.After reflow soldering on a heating table,the spreading and void rate of the solder joints were tested,and the influence of differ-ent weights of flux on the spreading rate and void rate was analyzed.The appropriate amount of flux immersion was screened.The experimental results show that when the weight of the flux accounts for 2.5%of the mass of the dip coated solder,the spreading area is larger,the minimum void rate is 6.1%,and the residue is moderate,resulting in the best welding effect.

关 键 词：助焊剂 锡银铜合金焊片 扩展率 空洞率 

分 类 号：TG42[金属学及工艺—焊接]