陶瓷转接板制备技术与应用进展  

Progress in preparation technology and application of through ceramic via interposer

作　　者：王卿 王莎鸥 彭洋 刘松坡 陈明祥[5] WANG Qing;WANG Shaou;PENG Yang;LIU Songpo;CHEN Mingxiang(School of Energy and Power Engineering,Huazhong University of Science and Technology,Wuhan 430074,China;Institute 23,Second Academy of China Aerospace Science and Industry Corporation,Beijing 100854,China;School of Aerospace Engineering,Huazhong University of Science and Technology,Wuhan 430074,China;Wuhan Ledstar Technology Co.Ltd.,Wuhan 430070,China;School of Mechanical Science and Engineering,Huazhong University of Science and Technology,Wuhan 430074,China)

机构地区：[1]华中科技大学能源与动力工程学院,湖北武汉430074 [2]中国航天科工集团第二研究院二十三所,北京100854 [3]华中科技大学航空航天学院,湖北武汉430074 [4]武汉利之达科技股份有限公司,湖北武汉430070 [5]华中科技大学机械科学与工程学院,湖北武汉430074

出　　处：《华中科技大学学报(自然科学版)》2024年第12期1-20,共20页Journal of Huazhong University of Science and Technology(Natural Science Edition)

基　　金：国家自然科学基金资助项目(62274069)。

摘　　要：随着芯片功率增加和封装集成度不断提高,热积累引发的器件可靠性问题日益严重.封装基板是实现芯片支撑与保护、电互连和散热的关键材料,直接影响器件性能与可靠性.陶瓷转接板为含有表面布线层和垂直互连结构的陶瓷基板,具有导热/耐热性好、图形精度高和可垂直互连等技术优势,满足了功率半导体器件小型化、集成化、高可靠封装需求,在半导体照明(白光发光二极管)、杀菌消毒(深紫外发光二极管)、激光与光通信、电力电子、高温传感、热电制冷、微波射频等领域得到广泛应用,并在先进封装中起重要作用.为了制备高性能陶瓷转接板,须要解决陶瓷微通孔激光加工、无缺陷电镀填孔、高速低应力厚铜电镀、陶瓷覆铜板表面研磨等关键技术.首先介绍了陶瓷转接板发展历史,然后重点分析了陶瓷转接板制备关键技术,最后对陶瓷转接板应用进行了展望.With the increase in chip power and package integration,the reliability issues of devices caused by heat accumulation become much more severe.The package substrate is the critical material for chip support,protection,electrical interconnection and heat dissipation,which directly affects the performance and reliability of the device.Through ceramic via(TCV)interposer is a kind of ceramic substrate with redistribution layers and vertical interconnections,which has the advantages of excellent heat conductivity,satisfactory heat resistance,high circuit accuracy,the ability to interconnect vertically,and could meet the needs of miniaturization,integration,and high reliability of power device packaging.Through ceramic via interposer has been widely used in semiconductor lighting(white lighting emitting diode,white LED),sterilization and disinfection(ultraviolet-LED),laser and optical communication,power electronics,high-temperature sensing,thermoelectric cooling,microwave,radio frequency,and other fields,which plays an essential role in advanced packaging.To prepare a high-performance through ceramic via interposer,it is necessary to solve the key technologies such as ceramic via laser processing,defect-free via filling,high-speed and low-stress thick copper pattern plating,and copper surface grinding.The development history of the through ceramic via interposer was introduced first,then the key preparation technology was analyzed,and the application of through ceramic via interposer was finally summarized.

关 键 词：陶瓷转接板(TCV) 激光打孔 电镀填孔 高速电镀 先进封装 功率半导体 三维集成 

分 类 号：TN305[电子电信—物理电子学]