0.25mmBGA板级装联工艺技术研究  

0.25BGA board level assembly process technology research

作　　者：李玉[1] 梁佩 徐季 魏斌[2] 陈海峰[2] LI Yu;LIANG Pei;Xu Ji;WEI Bin;CHEN Hai-feng(Nanjing University of Information Science&Technology;The 58th Electronic Research Institute)

机构地区：[1]南京信息工程大学 [2]中国电子科技集团第五十八研究所

出　　处：《中国集成电路》2025年第3期76-80,共5页China lntegrated Circuit

摘　　要：以0.25mm球径球栅阵列(BGA)封装器件作为研究对象,通过板级装联工艺试验总结出最佳植球印刷焊接参数。试验研究了植球钢片、钢网设计、回流温度等因素对窄球径BGA焊点的焊接质量影响,开展了焊点可靠性验证。试验结果表明,针对0.25mm球径BGA器件开口0.35厚度0.15的植球钢片为最佳选择,采用0.1mm厚度的印刷钢网可得到最佳印刷效果,焊接时回流峰值温度应设置在270℃左右。根据研究结果,探索出了一条完整可靠的0.25mm BGA板级装联工艺路线。Taking the 0.25 ball diameter BGA package device as the research object,the optimal ball-implanted printing soldering parameters were summarised through the board-level assembly process test.In this paper,we investigated the influence of ball-planting steel sheet,stencil design,reflow temperature and other factors on the welding quality of narrow ball diameter BGA welded joints,and carried out reliability verification of welded joints.Test results show that for the 0.25 ball BGA device,the opening diameter of 0.35 and thickness of 0.15 of the planted ball steel for the best parameters,Printing stencils with a thickness of 0.1 give the best printing results,and the peak reflow temperature should be set at around 270℃ during welding.Based on the results of the study,a complete and reliable 0.25 BGA board level assembly process route was explored.

关 键 词：0.25mmBGA 植球印刷 可靠性验证 回流焊 

分 类 号：TN405[电子电信—微电子学与固体电子学]