高电导率低粗糙度铜镀层制备方法及性能研究  

Preparation methods and performance study of high conductivity and low roughness copper platings

作　　者：邓光洋 谢久男 凌惠琴[1] 胡安民[1] 李明[1] Deng Guangyang;Xie Jiunan;Ling Huiqin;Hu Anmin;Li Ming(School of Materials Science and Engineering,Shanghai Jiao Tong University,Shanghai,200240)

机构地区：[1]上海交通大学材料科学与工程学院,上海200240

出　　处：《电镀与精饰》2025年第3期18-25,共8页Plating & Finishing

摘　　要：高频高速信息传输需求的增加对高速背板连接器提出了更高要求,尤其是在高频高速状态下的信号完整性问题。高频信号传输损耗严重,其中一个重要影响因素为趋肤效应。趋肤效应使得信号主要集中于导体表面传输,因此表面镀层的表面粗糙度以及电导率对传输损耗影响将被放大。为此,本文集中于信号传输层的纯铜镀层,探究了不同添加剂对纯铜镀层表面粗糙度和电导率的影响。结果表明特定添加剂组合能够有效降低纯铜镀层的表面粗糙度、提高导电性,有利于降低连接器镀层的传输损耗。The increasing demand for high-frequency and high-speed information transmission imposes stringent requirements on backplane connectors,particularly regarding signal integrity at elevated frequencies.High-frequency signal transmission losses are significant issues,with one major contributing factor being the skin effect.This phenomenon causes signals to predominantly concentrate on the surface of the conductor,thereby amplifying the impact of surface roughness and the conductivity of the surface plating on transmission loss.In this paper,we investigate the effects of various additives on the surface roughness and electrical conductivity of pure copper platings.Results demonstrate that some specific combinations of additives can effectively reduce the surface roughness of the copper plating and enhance its electrical conductivity,subsequently decrease the transmission loss associated with connector platings.

关 键 词：铜镀层电沉积 高速背板连接器 信号完整性 表面粗糙度 

分 类 号：TQ153.14[化学工程—电化学工业]