某型PBGA芯片混装回流焊工艺及质量控制  

Process and Quality Control of Reflow Soldering for PBGA Chip

作　　者：杨伟[1] 黎全英[1] 巫应刚[1] 任康桥 YANG Wei;LI Quanying;WU Yinggang;REN Kangqiao(The 30th Research Institute of CETC,Chengdu 610041,China)

机构地区：[1]中国电子科技集团公司第三十研究所,成都610041

出　　处：《电子工艺技术》2025年第2期1-6,共6页Electronics Process Technology

基　　金：十四五装备预先研究共用技术项目(50923070107)。

摘　　要：为满足电子设备可靠性要求,新品元器件在产品装配前首先应分析潜在的质量风险,然后开展工艺验证,最后得出新品元器件的生产工艺和质量控制措施。针对某型FC-PBGA芯片,分析了芯片结构特点及生产工艺对芯片的影响,根据引起芯片分层的质量控制要点,提出混装回流焊工艺验证方案,从存储、烘烤、车间放置、回流焊进行了工艺试验,结合声学扫描检测,得出了最佳工艺参数及生产过程控制措施,再从实际产品多芯片焊接需求出发,进行返修性和批量生产验证,最后形成了该型芯片的混装回流焊生产工艺及质量控制措施。To meet the reliability requirements of electronic equipment,potential quality risks should be analyzed before assembling new components,followed by process validation,and finally the production process and quality control measures for new components are determined.The structural characteristics of a certain type of FC-PBGA chip and the impact of production processes on the chip are analyzed.Based on the quality control points that cause chip delamination,a mixed reflow soldering process validation plan is proposed.Process tests are conducted from storage,baking,workshop placement and reflow soldering,combined with acoustic scanning detection to obtain the optimal process parameters and production process control measures.From the actual multi chip soldering requirements of the product,rework and batch production validation are carried out,and finally the mixed reflow soldering production process and quality control measures for this type of chip are formed.

关 键 词：PBGA 混装回流焊 工艺研究 芯片分层 

分 类 号：TN605[电子电信—电路与系统]