全银体系国产化LTCC基板工艺的关键技术  

Key Technology for Domestic Pure Silver LTCC Substrates

作　　者：马涛[1] 张鹏飞 李靖巍 MA Tao;ZHANG Pengfei;LI Jingwei(Anhui Province Key Laboratory of Microsystem,the 43rd Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第四十三研究所微系统安徽省重点实验室,合肥230088

出　　处：《电子工艺技术》2025年第2期19-23,共5页Electronics Process Technology

摘　　要：研究了全银体系国产化LTCC基板的填孔、烧结及化学镀镍钯金工艺。分析了浆料性能和掩模版参数对填孔工艺质量的影响,探讨了基板烧结平整性与收缩一致性的控制方案,并剖析了化学镀镍钯金工艺的影响因素。研究表明,填孔浆料的收缩率、触变性能以及掩模版的厚度和孔径均会显著影响填孔工艺质量;导体浆料的烧结收缩率、基板烧结温度及等静压工艺则直接关系基板的平整性和收缩一致性;LTCC材料特性及化学镀镍钯金工艺对表层金属化质量产生重要影响。The technology of via filling,cofiring and electroless nickel electroless palladium immersion gold for domestic pure silver LTCC substrates is studied.The influence of silver via paste properties and mask plate parameters on the quality of the filling process is analyzed.The objective is to identify a solution for controlling the sintering flatness and shrinkage consistency of LTCC substrates.The influencing factors of electroless nickel electroless palladium immersion gold are analyzed.The results indicate that the shrinkage rate,thixotropic properties of the paste,and the thickness and aperture of the mask plate significantly affect the quality of the via filling process.Furthermore,the sintering shrinkage ratio of conductor paste,sintering temperature and isostatic pressing process impact the flatness and shrinkage consistency of the substrate.Additionally,the properties of the LTCC material and the electroless nickel electroless palladium immersion gold process affect the surface metallization quality.

关 键 词：银浆 LTCC 填孔 烧结 化学镀镍钯金 

分 类 号：TN605[电子电信—电路与系统]