μBGA焊接缺陷分析与改善  

Analysis and Improvement ofμBGA Soldering Defects

作　　者：高燕青 黎全英[1] GAO Yanqing;LI Quanying(The 30th Research Institute of CETC,Chengdu 610041,China)

机构地区：[1]中国电子科技集团公司第三十研究所,成都610041

出　　处：《电子工艺技术》2025年第2期24-27,共4页Electronics Process Technology

摘　　要：BGA器件的出现促进了SMT的发展和革新,因其高度集成、体积小、性能稳定,在多个领域得到了广泛的应用,μBGA是一种更小的BGA形式。对μBGA器件出现的焊接缺陷进行了分析,排除了焊接工艺问题、器件本身问题。通过优化印制板焊盘的设计方式,解决了μBGA焊接缺陷。The emergence of BGA devices has promoted the development and innovation of SMT.Because of its high integration,small size,stable performance,it has been widely used in many fields,μBGA is a smaller form of BGA.The soldering defects ofμBGA devices are analyzed,and the soldering process problems,the device itself problems are excluded.The defects ofμBGA soldering are solved by optimizing the design of pad of printed board.

关 键 词：SMT μBGA 焊接缺陷 印制板 焊盘 

分 类 号：TN605[电子电信—电路与系统]