LTCC基板共烧焊盘的可焊性分析  

Solderability Analysis of Co-fired Soldering Pad of LTCC Substrate

作　　者：孙建彬 陈翔 董军荣 SUN Jianbin;CHEN Xiang;DONG Junrong(Nanjing Electronic Equipment Research Institute,Nanjing 210007,China;Xi’an Xinchuang Electronic Technology Co.,Ltd.,Xi’an 710075,China)

机构地区：[1]南京电子设备研究所,南京210007 [2]西安欣创电子技术有限公司,西安710075

出　　处：《电子工艺技术》2025年第2期38-41,共4页Electronics Process Technology

摘　　要：FBGA与LTCC基板的焊接可靠性直接影响TR组件的功能实现以及性能一致性。针对样件中出现的虚焊,进行了各种原因分析,最终确认LTCC基板共烧焊盘上玻璃相富集是导致焊接可靠性下降的主要原因,同时分析了玻璃相产生的机理及其影响因素。通过大量样件试验,探索出适合本项目的LTCC烧结温度,为后续量产提供技术保障。The soldering reliability between FBGA and LTCC substrate directly affects the functional implementation and performance consistency of TR components.According to the faulty soldering in the sample,various reasons are analyzed.The final confirmation shows that the enrichment of glass phase on the co-fired solder pad of the LTCC substrate is the main reason for the decrease in soldering reliability.The mechanism of glass phase forming and its influencing factors are analyzed.Through extensive sample testing,the LTCC sintering temperature suitable for the project is explored to provide technical support for subsequent mass production.

关 键 词：LTCC 玻璃相 共烧焊盘 可焊性 

分 类 号：TN605[电子电信—电路与系统]