引起印制电路板ICD失效的关键要素(续完)  

Key Elements of PCB ICD Failure

作　　者：毕文仲[1] 徐伟明[1] 曾福林[1] 安维[1] BI Wenzhong;XU Weiming;ZENG Fulin;AN Wei(ZTE Corporation,Shenzhen 518057,China)

机构地区：[1]中兴通讯股份有限公司,广东深圳518057

出　　处：《电子工艺技术》2025年第2期59-62,共4页Electronics Process Technology

摘　　要：从印制电路板ICD问题定义和缺陷类型展开分析,设计试验方案,验证ICD问题关键要素和产生的机理,从设计、板材、钻孔、去钻污、孔金属化5个方面分析验证,得出验证结果,提出改善预防措施,为PCB从业者提供借鉴。From the analysis of ICD problems and defect types of PCB,the test scheme is designed to verify the key elements and generation mechanism of ICD problems.Analysis and verification from five aspects of design,materials,drilling,dirt removal and hole metallization,verification results are obtained,and preventive measures are proposed to provide reference for PCB practitioners.

关 键 词：ICD 高速板材 钻孔 去钻污 

分 类 号：TN60[电子电信—电路与系统]