玻璃通孔成型工艺及应用的研究进展  

Research Progresses in Forming Process and Applications of Through Glass Via

作　　者：刘丹 乌李瑛 田苗 张文昊 程秀兰 Liu Dan;Wu Liying;Tian Miao;Zhang Wenhao;Cheng Xiulan(Center for Advanced Electronic Materials and Devices,School of Electronic Information and Electrical Engineering,Shanghai Jiao Tong University,Shanghai 200240,China)

机构地区：[1]上海交通大学电子信息与电气工程学院先进电子材料与器件平台,上海200240

出　　处：《微纳电子技术》2025年第4期49-69,共21页Micronanoelectronic Technology

基　　金：国家自然科学基金重点项目(62335014);国家科技部“十四五”重点研发计划(2023YFC2413001);上海市科技创新行动计划(22501100800);上海交通大学决策咨询重点课题实验技术专项(JCZXSJA2023-05)。

摘　　要：随着摩尔定律逐渐逼近其物理极限,传统封装技术已经不能满足智能化时代对芯片的轻量化和高集成化的需求。三维堆叠封装通过多层堆叠和立体互连实现了芯片和器件的高性能集成。其中通孔结构在三维集成封装中发挥着极为关键的作用。由于玻璃材料具有优异的电学性能、机械和化学稳定性,玻璃通孔(TGV)技术被认为是下一代三维集成的关键技术。系统性地回顾了TGV成型工艺的研究进展,对比了不同TGV成型工艺的优缺点,总结了TGV的主要应用,讨论了TGV当前的发展情况及面临的挑战。As Moore's law approaches its physical limit,the traditional packaging technology has been unable to meet the needs of lightweight and high integration of chips in the era of intelligence.3D stacked packaging enables high performance integration of chips and devices through multilayer stacking and vertical interconnection.Among them,through via plays an extremely key role in 3D integrated packaging.Due to the excellent electrical properties,mechanical and chemical stabilities of glass,through glass via(TGV)is considered as a key technology for the next generation of 3D integration.This paper systematically reviews the research progresses of TGV forming process,compares the advantages and disadvantages of different TGV forming processes,summarizes the main applications of TGV,and discusses the current development and challenges of TGV.

关 键 词：中介层 基板 玻璃通孔(TGV) 封装 应用 

分 类 号：TN405[电子电信—微电子学与固体电子学]