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作 者:陈绪波 易双秦 张香朋 朱晨俊 李亚茹 刘川 叶永贵 CHEN Xubo;YI Shuangqin;ZHANG Xiangpeng;ZHU Chenjun;LI Yaru;LIU Chuan;YE Yonggui(The 29th Research Institute of China Electronics Technology Group,Chengdu 610036,China)
机构地区:[1]中国电子科技集团公司第二十九研究所,四川成都610036
出 处:《电子质量》2025年第3期78-84,共7页Electronics Quality
摘 要:引线键合是微电子封装领域中的关键工序,用于实现芯片与外部电路之间的电气连接和信号传输。在键合过程中,通过热、压力和超声能量的共同作用将金属引线与基板焊盘紧密结合。超声能量在引线键合工艺中起着重要的作用,但对于超声能量释放形式对焊线质量的影响目前尚未有详细的研究。以楔焊为例,设计不同的超声功率参数,通过焊点形状和键合强度的结果,研究不同的超声能量释放形式对焊线质量的影响。结果表明:超声能量的最佳释放形式是平缓释放;超声爬升较大或电压较小时,超声能量平缓释放,能有效地作用于焊点,保证焊线质量;无超声爬升或电压较大时,会使超声能量释放过于迅速,导致焊点过焊,严重影响焊线质量;对于不同电压,超声爬升推荐设置≥40 ms,可以保证超声能量释放平缓,避免焊线质量潜在的大幅下降风险。Lead bonding is a key process in the field of microelectronics packaging,which is used to realize the elec-trical connection and signal transmission between the chip and the external circuit.In the bonding process,the metal lead is closely bonded to the substrate pad by the combined action of heat,pressure and ultrasonic energy.Ultra-sonic energy plays an important role in wire bonding process,but the effect of ultrasonic energy release on wire qual-ity has not been studied in detail at present.Taking wedge welding as an example,different ultrasonic power param-eters are designed,and the influence of different ultrasonic energy release forms on the quality of welded wire is stud-ied by the results of solder joint shape and bonding strength.The results show that the best release mode of ultra-sonic energy is gentle release.When the ultrasonic climb is large or the voltage is small,the ultrasonic energy is gently released and can effectively act on the welding spot to ensure the quality of the welding line.If there is no ultra-sonic climb or the voltage is large,the ultrasonic energy will be released too quickly,which will result in over-welding of the solder joint and seriously affect the quality of the welding wire.For different voltages,ultrasonic climb is recommended to be greater than or equal to 40 ms,which can ensure the smooth release of ultrasonic energy and avoid the potential risk of substantial decline in welding wire quality.
关 键 词:引线键合 超声能量 键合质量 楔焊 超声电压 爬升时间
分 类 号:TN305.94[电子电信—物理电子学]
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