甲基红对电沉积铜行为的影响及在通孔填性中的应用  

Influence of methyl red on the behavior of electrodeposited copper and its application in through-hole filling

作　　者：张洋 张艺洁 张鸿志 钱懋林 向静 ZHANG Yang;ZHANG Yijie;ZHANG Hongzhi;QIAN Maolin;XIANG Jing(School of Smart Technology,Chongqing Preschool Education College,Chongqing 404047,China;Chongqing Engineering Research Center of New Energy Storage Devices and Applications,Chongqing University of Arts and Sciences,Chongqing 402160,China)

机构地区：[1]重庆幼儿师范高等专科学校,智能科技学院,重庆404047 [2]重庆文理学院重庆市高校新型储能器件及应用工程研究中心,重庆402160

出　　处：《化工进展》2025年第3期1542-1549,共8页Chemical Industry and Engineering Progress

基　　金：重庆市教委科学技术研究计划(KJQN202202902,KJZD-M202401304,KJZD-K202201306);重庆市自然科学基金(CSTB2022NSCQMSX0526);校级重点实验室科研平台(2021KYPT-04)。

摘　　要：通孔电镀铜是实现高性能印制电路板之间互连的方法之一,提高通孔电镀铜均镀能力对促进印制电路板技术的发展非常重要。本文旨在揭示甲基红对电镀液电化学性能、电沉积铜层表面形貌以及通孔电镀铜的影响。首先,借用电化学测试,分析了甲基红、对流速度对酸性电镀铜体系的电化学性能的影响。然后,通过电镀铜实验获得通孔电沉积铜层,借助粗糙度测试、X射线衍射测试,探究甲基红对电沉积铜层表面形貌的影响。最后,通过制备通孔切片,采用金相显微镜,获得甲基红对通孔电镀均匀性的影响。结果表明,当对流速度为0~1600r/min时,随着对流速度的增大铜沉积速率加快。当甲基红浓度为0~9mg/L时,随着甲基红浓度的增大铜沉积速率先加快后减慢。当甲基红浓度为6mg/L、电流密度为2A/dm^(2)时,铜层表面光亮,粗糙度为0.287μm,电镀通孔均匀性为0.978。综上所述,甲基红是一种具有去极化作用的特殊电镀铜整平剂。Electroplating copper within through-holes serves as a crucial technique for interconnecting high-performance printed circuit boards(PCBs).Improving the throwing power(TP)of copper plating through these holes is essential for advancing PCB technology.This article explored the influence of methyl red(MR)on three key aspects:the electrochemical behavior of the plating solution,the surface morphology of the electrodeposited copper layer and the uniformity of through-hole copper plating.Firstly,electrochemical assessments were conducted to examine how methyl red and flow velocity affect the performance of acidic copper electroplating systems.Subsequently,copper layers were electrodeposited within through-holes,and the effects of methyl red on the surface morphology of these copper layers were investigated through roughness measurements and X-ray diffraction analysis.Finally,to evaluate the effect on plating uniformity,cross-sections of the through-holes were prepared and analyzed by using a metallographic microscope.Within the range of 0—1600r/min,increasing convective velocity accelerated the copper deposition rate.Additionally,as the concentration of methyl red increases from 0 to 9mg/L,the deposition rate initially increased and then slowed down.Under the condition of a current density of 2A/dm^(2),the addition of 6mg/L MR could enhance the brightness of the copper layer surface,reduce the roughness to 0.287μm,and improve the TP of the plated through hole to 0.978.To summarize,methyl red was a special copper electroplating leveler with a depolarization effect.

关 键 词：通孔 电镀铜 甲基红 表面形貌 

分 类 号：TQ153.14[化学工程—电化学工业]