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作 者:李登科[1] LI Dengke(China Airborne Missile Academy,Luoyang 471009,China)
出 处:《电子与封装》2025年第4期18-23,共6页Electronics & Packaging
摘 要:随着塑封器件大规模应用于各类电子产品,对其可靠性的研究逐渐成为人们关注的热点。塑封材料的吸湿特性导致塑封器件对水汽十分敏感,因此研究塑封器件的湿热特性极具应用价值。基于ANSYS Workbench有限元软件对SO-8塑封器件进行了高压蒸煮试验仿真,分析了器件在湿热耦合试验条件下各个结构的应力、应变分布。仿真结果表明,SO-8塑封器件内部各个结构互相接触的位置存在较大的应力和应变,其中引脚框架和塑封料的界面存在的应力和应变相对较大,这些部位是塑封器件易发生分层现象的位置。结合SO-8塑封器件在高压蒸煮试验后的超声扫描图像可以发现,湿热耦合试验条件下SO-8塑封元器件的分层主要发生在引脚框架上,这一现象与有限元仿真结果一致,为SO-8塑封器件的设计与封装提供了重要参考。With the large-scale application of plastic-encapsulated devices in various electronic products,research on their reliability has gradually become a focal point.The hygroscopic properties of encapsulation materials make plastic-encapsulated devices highly sensitive to moisture,thus making the study of hygrothermal characteristics of plastic-encapsulated devices particularly valuable.Based on ANSYS Workbench finite element software,a high-pressure steam test simulation is conducted on the SO-8 plastic-encapsulated device.The stress and strain distributions in each structure of the device under hygrothermal coupling test conditions are analyzed.The simulation results indicate that significant stress and strain occur at the contact points between various internal structures of the SO-8 plastic-encapsulated device,with the large stresses and strains observed at the interface between the lead frame and the encapsulation material.These areas are prone to delamination in the plastic-encapsulated device.Combined with the ultrasonic scanning image of the SO-8 plastic-encapsulated device after the high-pressure steam test,it is found that the delamination of the SO-8 plastic-encapsulated device mainly occurs on the lead frame under hygrothermal coupling conditions,and this phenomenon is consistent with the finite element simulation results,which provides important references for the design and packaging of SO-8 plastic-encapsulated devices.
分 类 号:TN306[电子电信—物理电子学]
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