基于扩束动态干涉仪的晶圆抛光盘掠入射拼接面形测量方法  

Grazing Incidence Stitching Surface Measurement Method Based on Beam-Expanding Dynamic Interferometer

作　　者：芮九多 巫智勋 邓嘉信 张嘉博 韩志刚 王青[1,2] 朱日宏[1,2] Rui Jiuduo;Wu Zhixun;Deng Jiaxin;Zhang Jiabo;Han Zhigang;Wang Qing;Zhu Rihong(School of Electronic and Optical Engineering,Nanjing University of Science and Technology,Nanjing 210094,Jiangsu,China;MIIT Key Laboratory of Advanced Solid Laser,Nanjing University of Science and Technology,Nanjing 210094,Jiangsu,China)

机构地区：[1]南京理工大学电子工程与光电技术学院,江苏南京210094 [2]南京理工大学先进固体激光工业和信息化部重点实验室,江苏南京210094

出　　处：《光学学报》2025年第2期183-194,共12页Acta Optica Sinica

基　　金：国家自然科学基金(61875087)。

摘　　要：针对车间环境下晶圆抛光盘面形测量问题,提出使用基于扩束动态干涉仪的掠入射拼接干涉测量方法。该方法结合非球面扩束系统和子孔径拼接方法,弥补了动态干涉仪测量口径的不足;利用掠入射干涉测量解决了粗糙被测面光束散射问题,同时拓展了动态干涉仪的面形误差检测量程。研究了系统出射波前离焦变化问题,基于像散光圈自校准的子孔径拼接算法,有效消除了子孔径拼接过程中系统离焦的干扰,为高精度子孔径拼接测量提供算法保障。测量了直径为576 mm晶圆抛光盘样品表面,并与三坐标机测量结果进行对比。所提方法的截线高度测量结果的平均误差为0.1375μm,平面度误差为0.17μm。实验结果表明,所提方法具备晶圆抛光盘面形检测能力,拓展了动态干涉仪的应用范围。Objective The wafer polishing pad is a critical component in achieving global planarization of the wafer surface during the integrated circuit manufacturing process.Its surface shape has a significant effect on wafer yield.To optimize the shape of the wafer polishing pad,strict quality control measures are necessary.Precision measurement technology plays a vital role in ensuring quality.Currently,the integrated circuit industry is moving towards larger wafer sizes and smaller feature dimensions,presenting new challenges for measuring the shape of wafer polishing pads.Interferometry is one of the most effective and intuitive methods for surface measurement due to its non-contact nature,high accuracy,and rapid operation.However,traditional large-aperture Fizeau interferometers face significant manufacturing difficulties and high costs.Moreover,they often struggle to accurately measure the surface shapes of large-diameter wafer polishing pads due to limitations such as restricted dynamic range,light scattering,and diminished stripe contrast.Grazing-incidence interferometry provides an effective solution to these limitations,addressing issues related to aperture size,dynamic range,and contrast.Nevertheless,when measuring large-diameter wafer polishing pads with long interferometric cavity lengths,new challenges such as airflow disturbances and vibrations emerge.To address these issues,we propose to measure the surface shape of large-aperture wafer polishing pads using a grazing incidence splicing technique within a beam-expanding dynamic interferometer.Methods The challenges related to aperture size,dynamic range,and contrast in the interferometric measurement of large-aperture wafer polishing pad surfaces are effectively addressed through grazing incidence interferometry and subaperture stitching techniques.A high-precision and high-stability beam expansion system effectively compensates for the limitations of the dynamic interferometer regarding measurement aperture.At the same time,the inherent anti-interference c

关 键 词：晶圆抛光盘 动态干涉 掠入射 子孔径拼接 面形测量 

分 类 号：O436[机械工程—光学工程]