铝碳化硅复合材料T/R组件封装外壳的研制  

The Housing of Aluminum Silicon Carbide for T/R Modules

作　　者：熊德赣[1] 刘希从[1] 赵恂[1] 卓钺[1] 

机构地区：[1]国防科技大学航天与材料工程学院,湖南长沙410073

出　　处：《电子元件与材料》2003年第2期17-19,共3页Electronic Components And Materials

摘　　要：介绍了铝碳化硅复合材料T/R组件封装外壳的研制。用磷酸铝溶液、聚乙二醇、蒸馏水、糊精和淀粉配制碳化硅浆料的粘结剂,采用双向模压法制备带金属镶嵌件的近净成型的碳化硅预制件。碳化硅预制件经压力浸渗后得铝碳化硅复合材料构件坯料。构件坯料用金刚石砂轮和电火花进行少量机械加工,并进行化学镀镍后得到铝碳化硅复合材料T/R组件封装外壳。The development of the housing made form aluminum silicon carbide for T/R modules is presented. The binder used was mixed with acid phosphate aluminum, polyethylene glycol, distilled water, dextrin and starch. The near-net-shaped silicon carbide preformed units with metallic inserts were processed by two-direction pressing. AlSiC composites were fabricated by pressure-infiltrating porous silicon carbide particle preformed units. The housing of AlSiC composites were acquired after grinding with diamond wheels, electro-discharge machining, and electroless-nickel-deposit.

关 键 词：封装 铝碳化硅复合材料 预制件 T/R组件 压力浸渗 

分 类 号：TB33[一般工业技术—材料科学与工程]