铅基快淬钎料与电子焊膏焊点组织与力学性能的比较  

A Comparison of Microstructure and Mechanical Properties of Joints Soldered by RS Solder and Solder Paste

作　　者：黄乐[1] 唐祥云[1] 马莒生[1] 刁凤琼[1] 张五信[1] 

机构地区：[1]清华大学材料系,首钢公司北京冶金研究所

出　　处：《功能材料》1995年第3期271-274,共4页Journal of Functional Materials

摘　　要：在集成电路的一级封装中，常用高铅钎料，本文研究了使用高铅钎料时，镀金试样的焊点组织，并就新开发的快淬钎料与电子焊膏的焊点组织、力学性能做了对比研究。结果表明：快淬钎料焊点的组织均匀、细密，抗疲劳性能较好，在高可靠产品的生产中有较好的应用前景。The lead-rich solder is a kind of soft somer mainly used in the first level packaging of IC.The microstructure of gold-plating sample solderedby lead-rich solder was studied. The comparison ofmicrostructures,mechanical characteristics of jointssoldered by Rapidly Solidified(RS)solder and solderpaste was made,The result showed that themicrostructure of the joints soldered by the RS solderwas more homogeneous and flner, the anti-fatigueproperty was better than that of solder paste.So itcould be used in high-reliability products.

关 键 词：铅基快淬钎料 电子焊膏 焊点组织 力学性能 集成电路 

分 类 号：TN405[电子电信—微电子学与固体电子学] TG454[金属学及工艺—焊接]