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机构地区:[1]北京科技大学材料科学与工程学院,北京100083 [2]宜兴钟山微电子封装有限公司,江苏宜兴214221
出 处:《电子元件与材料》2003年第3期35-37,48,共4页Electronic Components And Materials
摘 要:研究了Ni底镀层和不同Co含量的Ni-Co合金底镀层对陶瓷封装芯腔镀金层表面抗高温变色能力的影响。420℃、15 min的高温考核表明:w(Co)超过10%以上的Ni-Co合金底镀层,对陶瓷封装芯腔表面抗高温变色能力明显优于纯Ni底镀层。镀层中w(Co)超过10%以上时,抗高温变色能力并不会随着Co含量增加而提高,仅随底镀层厚度的增加而明显增强。因而在陶瓷封装中,采用厚度大于4 mm的、含Co 15%左右的Ni-Co合金,代替Ni作为底镀层是可行的。Studied was the effect of Co content of the underlayer of Ni and Ni-Co alloy on the resistance to the surface discoloration of cavities in ceramic packages in high temperature aging. High-temperature test (heating at 420C for 15 minutes) result shows that it is possible to replace Ni with Ni-Co alloy as an underlayer when Co content is higher than 10 wt% in plating. The resistance to the surface discoloration of Ni-Co alloy underlayer at high-temperature almost not changes with the increase of Co content in the range from 10 wt% to 20 wt%. Resistance to surface discoloration of cavity in ceramic packages at high-temperature obviously increases with the increase of underlayer thickness. Ni-Co alloy of 4 mm in thickness and 15 wt% Co content is recommended to replace Ni as an underlayer in ceramic packages.
关 键 词:芯腔 高温变色 镍 镍-钴合金 底镀层 陶瓷封装 高温考核
分 类 号:TN305.94[电子电信—物理电子学]
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