制作圆片级封装凸焊点的垂直喷镀机研制  

The Research and Development of Vertical Fountain Plating for Making Bumps in Wafer Level Package

作　　者：王水弟[1] 胡涛[1] 贾松良[1] 

机构地区：[1]清华大学微电子学研究所,北京100084

出　　处：《电子工业专用设备》2003年第1期38-42,共5页Equipment for Electronic Products Manufacturing

摘　　要：介绍了为满足微电子新颖封装——圆片级封装(WLP)在硅圆片上制作凸焊点的需要,根据有限元分析模拟优化,设计研制了FEP-1垂直喷镀机。该机可用于φ100-φ150mm(φ4-φ6英寸)圆片上电镀Au、PbSn、In等凸焊点。在150mm液晶显示驱动电路硅圆片上,用该电镀机电镀制作出了合格的高度为17μm、间距为20μm的金凸点。This paper introduces the design and usage of FEP - 1 vertical fountain plating, which is met to fabricate bumps on wafers in wafer level package. Computational simulation and optimization by finite - element analysis (FEA) were used in designing vertical fountain plating. It is suitable for φ4-φ6 inches wafers to deposit bumps of Au, PbSn or hi. It was successful at fabrication of Au bumps on 6 inches wafers for LCD driver circuit. The height of bumps , which are fabricated by this machine, are 17 μm and the space is 20 /μrn.

关 键 词：圆片级封装 凸焊点 喷镀 电镀设备 微电子 WLP 

分 类 号：TN405.94[电子电信—微电子学与固体电子学]