Cu、Ni金属膜表面AgCu28钎料润湿性研究  

The wettability of the AgCu28 solder on Cu and Ni metal coatings

作　　者：廖春艳[1] 舒朝濂[1] 杭凌侠[1] 

机构地区：[1]西安工业学院光电科学与工程系,陕西西安710032

出　　处：《西安工业学院学报》2003年第1期78-82,共5页Journal of Xi'an Institute of Technology

摘　　要：　利用电弧离子镀技术,在1Cr18Ni9Ti不锈钢上镀制一层金属膜,研究AgCu28钎料在不锈钢上的润湿性.结果表明:镀Cu膜比镀Ni膜更有利于AgCu28钎料润湿性的提高;不使用磁过滤技术沉积金属膜有助于AgCu28钎料的铺展.在电弧离子镀过程中,是否采用磁过滤技术对AgCu28钎料润湿性的影响比采用不同金属材料(Cu或Ni)的影响更显著.A metal film is deposited on the stainless steel by arc ion deposition in order to study the wettability of solder AgCu28 on the stainless steel 1Cr18Ni9Ti. The results show that the wettability of AgCu28 is dependent on the coating on the surface of 1Cr18Ni9Ti. The copper coating is better than the nickel coating. The wettability is much better when magnetically filtered arc deposition system isn't used,which has more effect on the wettability.

关 键 词：电弧离子镀 润湿性 AgCu28钎料 

分 类 号：TG425[金属学及工艺—焊接]