与焊膏印刷质量缺陷相关联的工艺因素及其控制  

The Factors Related tothe Quality of SolderPaste Printing and Their Control

作　　者：叶洪勋 

出　　处：《丝网印刷》2003年第1期10-14,共5页Screen Printing

摘　　要：　从模版、焊膏、印刷机、刮刀、基板等方面叙述了影响焊膏印刷质量的诸多工艺操作因素,并简要地分析了产生质量缺陷的原因,提出了相应的控制对策。This article expounds the process factors af-fecting quality of solder paste printing in aspects of stencil,solder paste, printing press, squeegee and circuit base. It alsoanalyzes the cause to defects and offers trouble shooting mea-sures.

关 键 词：焊膏印刷 印刷质量 工艺控制 印刷线路板 网版印刷 

分 类 号：TS80[轻工技术与工程]