用红外热成像技术测量MEMS器件的热特性  

THERMAL CHARACTERISTICS MEASUREMENT OF MEMS DEVICES USING INFRARED THERMOGRAPHY

作　　者：朱德忠[1] 张荣海[1] 顾毓沁[1] 郝京阳[1] 

机构地区：[1]清华大学工程力学系,北京100084

出　　处：《工程热物理学报》2003年第4期679-681,共3页Journal of Engineering Thermophysics

基　　金：国家自然科学基金(No.59995550-1;59995550-5)

摘　　要：微电子机械系统(MEMS)的很多器件均凭借热工作原理,在其设计、性能评估中都需要了解热特性,特别是温度分布的动静态特性。本文用显微红外热成像技术测试分析了气体传感器微热板、微机械热对流加速度计的微加热器、热驱动微热泵芯片的温度分布特性及微辐射热计的热阻特性。在测试中考虑了对象的有效发射率等影响测量精度的系统因素。Many MEMS run on the basis of thermal principles, so it is necessary to know their thermal characteristics, especially temperature distribution, during design and evaluation. In this paper, an infrared thermography with the microscope set is used to measure the temperature distribution of the micro hotplate array, thermal accelerometer, micro pump and the thermal resistance of different structures of the microbolometer chips. Effective emissivity of the objects, and other factors that can affect the accuracy in measurement are considered.

关 键 词：MEMS 红外热成像 温度分布 

分 类 号：TK124[动力工程及工程热物理—工程热物理]