装配体的ICT仿真方法研究  

The Research on ICT Simulation of Assemblies

作　　者：汪鹏[1] 张树生[1] 王静[1] 刘晓翔[1] 孙宏伟[1] 王贺[1] 

机构地区：[1]西北工业大学CAD/CAM国家专业实验室,西安710072

出　　处：《计算机工程与应用》2003年第28期125-127,共3页Computer Engineering and Applications

基　　金：航空基础科学基金资助(编号:99H53111)

摘　　要：ICT的计算机仿真技术是ICT研究领域的重要内容之一,传统的仿真通常是针对单个零件的,而专门针对工业应用中常见的装配体的仿真研究还不够成熟。装配体具有“多零件多材质”的特点,通常的建模方法难以正确描述零件之间的装配关系,仿真难度大。该文针对装配体的这些特点,提出一种有效的装配体CAD建模方法,给出了装配体的ICT仿真算法和应用实例。仿真结果与现实的ICT图像具有很好的相近性,验证了算法的正确性。The technology of ICT(Industrial Computerized Tomography)Simulation is one of the most important concerns in the research field of ICT.The formal researches just focus on the simulations of single part and have no matured techniques to deal with the assemblies.It is the characteristics of″Multi-parts and Multi-materials″that make it hard to express the positions among assemblies and difficult to get the correct simulation result.To this problem,this paper pro-vides an efficient method to resolve the CAD model and ICT simulation algorithm of assemblies,as well as an example in a real application.The result of the simulation is very similar with the real ICT image,which proves the efficiency of the correspond method.

关 键 词：ICT 仿真 装配体 CAD建模 切片图像 

分 类 号：TP391.9[自动化与计算机技术—计算机应用技术]