改性聚酰亚胺封装基板的研制  

Study on sealed package substrate with modified polyimide resin

作　　者：严小雄 王金龙[1] 李小兰[1] 

机构地区：[1]国营第七O四厂研究所,陕西咸阳712099

出　　处：《绝缘材料》2003年第5期20-22,共3页Insulating Materials

摘　　要：以4,4—二苯甲烷双马来酰亚胺、二氨基二苯甲烷、环氧树脂为主要原料合成性能优良的改性聚酰亚胺树脂体系;以此树脂为基体,以芳酰胺无纺布为增强材料制作覆铜板;该板材具有玻璃化温度高、热膨胀系数小、介电常数低等优异的综合性能,用于制作封装用印制线路板可满足技术要求。A high performance modified resin is combined with 4,4diphenyl bismaleimide , diaminodiphenyl methane, epoxy. The copper clad laminate is made of the modified resin system and aromtic polyamide nonwoven cloth. Test results show that the laminate have high glass temperature, less coefficient of thermal expansion,lower dielectric constant. The copper clad laminate may be used for packaging printed circiut board. 

关 键 词：封装基板 聚酰亚胺 芳酰胺无纺布 覆铜板 

分 类 号：TM215.6[一般工业技术—材料科学与工程] TQ327.7[电气工程—电工理论与新技术]