声表面波器件压电芯片粘接工艺的可靠性研究  

Study on Reliability of Bonding Technique For Piezodielectric Chip in Surface Acoustic Wave Device

作　　者：陈台琼[1] 吴燕[1] 唐代华[1] 

机构地区：[1]中国电子科技集团公司第二十六研究所八室

出　　处：《电子质量》2003年第6期89-91,共3页Electronics Quality

摘　　要：本文对声表面波(SAW)器件失效模式以及SAW器件粘片失效模式进行了初步分类和探讨。通过对粘片工序几种失效模式的对比试验、总结了一套针对该工序的较为完整的粘片可靠性增长的控制措施。The article preliminarily classifies and discusses the failure modes of surface acoustic wave (SAW) devices and failure modes of SAW device bonding. Through the control tests for several failure modes of bonding technique, it summarizes a relatively complete set of controlling measures for enhanced bonding reliability.

关 键 词：声表面波器件 SAW 失效模式 粘片 粘接强度 可靠性 

分 类 号：TN65[电子电信—电路与系统]