脉冲激光MEMS加工技术  

Applications of pulsed laser microfabrication technology in MEMS

作　　者：李艳宁[1] 唐洁[1] 饶志军[1] 宋晓辉[1] 胡晓东[1] 傅星[1] 胡小唐[1] 

机构地区：[1]天津大学精密测试技术及仪器国家重点实验室,天津300072

出　　处：《微纳电子技术》2003年第7期159-163,共5页Micronanoelectronic Technology

基　　金：国家高技术研究发展专项基金资助项目(2 0 0 2AA40 40 90 7);教育部留学回国人员科研启动基金项目

摘　　要：阐述了脉冲激光微加工技术及其在微机电系统 (MEMS)加工中的应用。脉冲激光微加工技术能够制作出三维微型结构并具有微米 /亚微米加工精度 ,且适用于多种材料 ,与传统的微细加工技术如光刻、刻蚀、体硅和面硅加工技术等相比具有其独到之处。进一步阐述了基于激光烧蚀的脉冲激光直接微加工技术、激光 LIGA技术。The pulsed laser microfabrication technologies and their applications in MEMS manufacture are reviewed. The high energy pulsed lasers have 3 dimension microstructure fabrication capabilities with micro/sub micro precision, and are applicable to a wide range of materials. Therefore, compared with traditional microfabrication technologies, such as lithography, etching, bulk and surface silicon micromaching processes, pulsed laser microfabrication processes are quite unique.The pulsed laser direct fabrication of MEMS, laser LIGA processes, laser assisted etching and deposition processes, laser assisted micromanipulation and assembly technologies are discussed.

关 键 词：脉冲激光 MEMS加工技术 微机电系统 激光烧蚀 集成电路 

分 类 号：TN405[电子电信—微电子学与固体电子学] TN249