分析多芯片组件互连延时的一种新方法  

A New Approach to the Analysis of Interconnect Delay for MCM

作　　者：董刚[1] 杨银堂[1] 李跃进[1] 

机构地区：[1]西安电子科技大学微电子研究所,陕西西安710071

出　　处：《电路与系统学报》2004年第1期142-144,共3页Journal of Circuits and Systems

基　　金：国防预研基金(41323020204)

摘　　要：随着多芯片组件工作频率的不断增加,信号延时受互连的影响越来越大,互连已成为决定系统性能的主要因素。延时与冲激响应有着密切的联系,本文采用系统冲激响应的低阶矩,基于双极点近似对互连的延时特性进行了研究。与已有的方法比较,本文的方法提高了极点选择的稳定性,适用于复杂的互连网络。举例证明了这种方法的有效性。As Multi-Chip-Module (MCM) operating frequencies increase, signal delay is seriously affected by interconnects. Interconnect becomes the dominant factor in determining system performance. Moments of the impulse response are closely related with the interconnect delay. Based on the two-pole approximation, low-order moments are used to analyze the delay characteristic of interconnection. Compared with other methods, stability of selecting poles can be improved by the proposed method. Therefore, it is useful for complicated networks. Example is presented to show that the method is effective.

关 键 词：多芯片组件 互连延时 低阶矩 双极点近似 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]