准分子激光直写加工特性与脉冲参数关系的研究  

Relationship between etching identities and laser pulse parameters in excimer laser direct etching fabrication

作　　者：魏仁选[1] 

机构地区：[1]武汉理工大学光纤传感技术研究中心国家光纤传感技术工业性实验基地,武汉430070

出　　处：《激光技术》2004年第1期85-87,共3页Laser Technology

摘　　要：以玻璃为实验靶材 ,用精密微动平台准确调节靶材位置 ,利用波长 2 4 8nm的KrF准分子激光器 ,研究了准分子激光直写加工图形和激光脉冲数及脉冲能量之间的关系。实验证明 ,随着加工槽深度的增大 ,单个激光脉冲所烧蚀的深度逐渐减小 ,当达到一定的脉冲数时 ,所烧蚀槽的深度基本上保持不变。脉冲能量越大 ,刻蚀速率越大 。KrF excimer laser, whose wavelength is 248nm, is directly used to ablate and etch glass material;the location of processed material is accurately controlled by a micro motion controlling system. The relationships between laser pulse parameters, the number and energy and characteristics of yielded grooves are investigated. It is shown that the ablation depth of a single laser pulse becomes smaller and smaller along with the increasing of laser pulse amount. Furthermore, the depth of the yielded grooves becomes constant when the laser pulses add up to a definite number. The more the energy of laser pulse the more the etching speed is. There is an upper limit for the etching speed.

关 键 词：准分子激光 微加工 刻蚀 能量 

分 类 号：TG665[金属学及工艺—金属切削加工及机床]