银基多层氮化铝陶瓷基板低温共烧的工艺研究  

Research of LTCC technology of silver-base multilayer AlN ceramic substrates

作　　者：戎瑞芬[1] 汪荣昌[1] 顾志光[1] 

机构地区：[1]复旦大学材料科学系,上海200433

出　　处：《半导体技术》2004年第3期41-43,75,共4页Semiconductor Technology

摘　　要：从低温共烧的工艺角度来研究氮化铝坯片和银浆的排胶,从而确立排胶的温度及烧结气氛的控制。结果表明,二次排胶法与在氮气气氛中加入微量氧进行烧结,获得了综合性能优良的银布线多层陶瓷基板。The process of organic vehicle evacuation of AlN green tape and Ag conductor pastehave been researched in the view of LTCC technology, and optimum condition of organic vehicleevacuation temperature and cofiring atmosphere have been determined. The result shows that thebest comprehensive properties of silver conductor multilayer AlN ceramic substrates can beenachieved by two-step organic vehicle evacuation technology and cofire the substrate using mixedatmosphere gases of nitride and micro fraction of oxide.

关 键 词：低温共烧 氮化铝 银浆 排胶 银布线多层陶瓷基板 

分 类 号：TN405[电子电信—微电子学与固体电子学]