国家自然科学基金(BK2002010)

作品数：2被引量：3H指数：1
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相关期刊：《Semiconductor Photonics and Technology》《Chinese Journal of Mechanical Engineering》更多>>
相关主题：CMPCEOPRECURSORPOLISHINGULTRAFINE更多>>
相关领域：金属学及工艺电子电信更多>>
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Effect of Nano-sized CeO_2 Abrasives on Chemical Mechanical Polishing of Silicon Wafer
《Semiconductor Photonics and Technology》2006年第2期81-84,94,共5页ZHANG Bao-sen CHEN Yang 
Natural Science Foundation of Jiangsu Province ( BK2002010) ; High-tech Project of Jiangsu Province(BG2004022)
The conception of the soft layer during chemical mechanical polishing(CMP) was proposed for the first time. The soft layer was a reaction layer formed on the silicon surface; it was softer than the silicon substrate a...
关键词：CMP Cerium oxide Soft layer Chemical effect 
MORPHOLOGY CONTROL OF ULTRAFINE CeO_2 AND ITS POLISHING EFFICACY被引量：3
《Chinese Journal of Mechanical Engineering》2005年第1期14-16,共3页ChenJianqing ChenZhigang LiJinchun 
This project is supported by Provincial Natural Science Foundation of Jiangsu (No.BK2002010).
Homogenous precipitation and subsequent calcination has been used tosynthesize ultrafine ceria from cerium nitrate and urea solution. The ceria calcined from theprecursor inherit the size and morphology of it. The siz...
关键词：Cerium dioxide (CeO_2) precursor Homogenous precipitation Ageing time Chemical-mechanical polishing (CMP) 
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