云南高校图书馆联盟文献共享服务平台- WARPAGE

WARPAGE: 作品数：21被引量：63H指数：4; 导出分析报告; 相关作者：王正荣周慧玲杨巍华秦振凯冯磊更多>>; 相关机构：华为技术有限公司华西医科大学江西医学院第二附属医院更多>>; 相关期刊：《Computers, Materials & Continua》《Journal of Iron and Steel Research International》《Microsystems & Nanoengineering》《实验力学》更多>>; 相关基金：国家自然科学基金更多>>

A warpage-free Si3N4 slurry strategy for vat photopolymerization: 《Journal of Advanced Ceramics》2025年第1期193-204,共12页Chi Huang Liya Zheng Zhilin Tian Lei Shi Bin Li; financially supported by the Leading Talent Project of the National Special Support Program(No.2022WRLJ003);the National Natural Science Foundation of China(No.52202126);Guangdong Basic and Applied Basic Research Foundation(No.2021B1515020083);Shenzhen Science and Technology Program(Nos.202206193000001 and 20220818183014003).; Si3N4 ceramics are promising wave-transparent materials with excellent mechanical and dielectric properties.Vat photopolymerization(VPP)three-dimensional(3D)printing provides a strategy for preparing ceramics with con...; 关键词：three-dimensional(3D)printing vatphotopolymerization SigN4 WARPAGE mechanical properties

Correction of thermal airflow distortion in warpage measurements of microelectronic packaging structures via deep learning-based digital image correlation被引量：1: 《Microsystems & Nanoengineering》2024年第4期403-414,共12页Yuhan Gao Yuxin Chen Ziniu Yu Chuanguo Xiong Xin Lei Weishan Lv Sheng Liu Fulong Zhu; supported by the National Natural Science Foundation of China[grant number:U20A6004 and grant number:52075208].; The projected speckle-based three-dimensional digital image correlation method(3D-DIC)is being increasingly used in the reliability measurement of microelectronic packaging structures because of its noninvasive nature...; 关键词：THERMAL DISTORTION IMAGE

Effect of warpage on the electronic structure and optical properties of bilayer germanene: 《Journal of Semiconductors》2022年第12期39-45,共7页Qihang Xiong Weifu Cen Xingtong Wu Cong Chen; supported by the Science and Technology Foundation of Guizhou Province,China(Nos.1Y[2020]200,1Y[2020]205);the Youth Science and Technology Talents Growth Fund Program of the Ministry of Education Province,China(Nos.KY[2021]105,KY[2021]103).; The electronic structure and optical properties of bilayer germanene under different warpages are studied by the first-principles method of density functional theory.The effects of warpages on the electronic structure...; 关键词：bilayer germanene warpages electronic structure optical properties FIRST-PRINCIPLES

Analysis of longitude profiled rolling process of Cu/Al cladded sheet and evaluation of outlet warpage: 《Journal of Iron and Steel Research International》2022年第6期973-982,共10页Jing-na Sun Chi Chen Shuo Wang Guan-nan Liu Hua-gui Huang; The research was financially supported by the National Natural Science Foundation of China(Grant Nos.51674222 and 51974278);Yanshan University(15LGAOO3).; Longitude profiled cladded sheet is obtained by rolling bimetal cladded sheet with variable gauge rolling technology.The longitude profiled rolling process of Cu/Al cladded sheets was studied by finite element method ...; 关键词：LONGITUDE profiled ROLLING Cladded SHEET ROLLING force Layer thickness ratio OUTLET WARPAGE Asymmetric ROLLING

Minimizing Warpage for Macro-Size Fused Deposition Modeling Parts被引量：1: 《Computers, Materials & Continua》2021年第9期2913-2923,共11页Thanh Thuong Huynh Tien V.T.Nguyen Quoc Manh Nguyen Trieu Khoa Nguyen; The work presented in this study was orally presented at the first China–Vietnam symposium on precision manufacturing–CVPMS 2018,Industrial University of Ho Chi Minh City in Vietnam.; In this study,we investigated warpage and corner lifting minimization for three-dimensional printed parts generated by macro-size fused deposition modeling(FDM).First,the reasons for warpage were theoretically elucida...; 关键词：Fused deposition modeling corner lifting volumetric shrinkage thermal deformation acrylonitrile butadiene styrene filament

Numerical investigation of a novel pattern for reducing residual stress in metal additive manufacturing被引量：5: 《Journal of Materials Science & Technology》2021年第8期11-22,共12页Li Sun Xiaobo Ren Jianying He Zhiliang Zhang; funded by the Chinese Scholarship Council and the Research Council of Norway through the Petromaks2 program(Project No.281927);the BIA Program(Project No.269558)。; Deposition patterns can significantly affect residual stress distribution in additive manufacturing processes.In this paper,a novel pattern,the S-pattern,is proposed for the metal additive manufacturing process.The fi...; 关键词：Additive manufacturing(AM) Deposition pattern Temperature distribution Residual stress WARPAGE

Flash Lamp Annealing Method for Improving Adhesion Strength on the Dielectric Material and Reducing Substrate Warpage: 《材料科学与工程（中英文B版）》2019年第3期113-121,共9页Jong-Young Park Byeong-Jae Choi Young-Jae Kim Hideo Honma Joo-Hyong Noh; Today’s electronic devices have required higher performance properties for 5G and artificial intelligence(AI).High-performance system on chip(SOC),graphic processing unit(GPU),and central processing unit(CPU)requires...; 关键词：High performance device advanced PACKAGE LOW-LOSS DIELECTRIC material WARPAGE control FLA

Optimization of investment casting process parameters to reduce warpage of turbine blade platform in DD6 alloy被引量：4: 《China Foundry》2017年第6期469-477,共9页Jia-wei Tian Kun Bu Jin-hui Song Guo-liang Tian Fei Qiu Dan-qing Zhao Zong-li Jin Yang Li; financially supported by the National Natural Science Foundation of China(No.51371152); The large warping deformation at platform of turbine blade directly affects the forming precision. In the present research, equivalent warping deformation was firstly presented to describe the extent of deformation at...; 关键词：PROCAST optimization of process parameters warping deformation of platform orthogonal test genetic algorithm BP-neural network

Analytical investigation on thermal-induced warpage behavior of ultrathin chip-on-flex(UTCOF) assembly: 《Science China(Technological Sciences)》2016年第11期1646-1655,共10页CHEN JianKui XU ZhouLong HUANG YongAn DUAN YongQing YIN ZhouPing; supported by the National Natural Science Foundation of China (Grant Nos. 51475195, 51322507 & 91323303);National Science and Technology Support Program (Gant No. 2015BAF11B02); The serious warpage issues of ultrathin chip-on-flex(UTCOF) assembly induced by mismatched thermal stresses have greatly affected the mechanical stability and reliability of emerging ultrathin chip packaging technolog...; 关键词：microelectronic packaging WARPAGE layerwise theory ultrathin chip

Pre-compensation of Warpage for Additive Manufacturing被引量：1: 《Journal of Mechanics Engineering and Automation》2016年第8期392-399,共8页Christoph Schmutzler Fabian Bayerlein Stephan Janson Christian Seidel Michael F. Zaeh; Additive manufacturing technologies enable the production of parts by successively adding layers. In powder-based technologies, each powder layer is selectively solidified following the respective cross-section of the...; 关键词：Additive manufacturing SHRINKAGE WARPAGE COMPENSATION PRE-DEFORMATION simulation.

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