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Microsphere-assisted hyperspectral imaging:super-resolution,non-destructive metrology for semiconductor devices
《Light(Science & Applications)》2024年第6期1098-1111,共14页Jangryul Park Youngsun Choi Soonyang Kwon Youngjun Lee Jiwoong Kim Jae-joon Kim Jihye Lee Jeongho Ahn Hidong Kwak Yusin Yang Taeyong Jo Myungjun Lee Kwangrak Kim 
As semiconductor devices shrink and their manufacturing processes advance,accurately measuring in-cell critical dimensions(CD)becomes increasingly crucial.Traditional test element group(TEG)measurements are becoming i...
关键词：METROLOGY RESOLUTION enable 
Non-destructive OAM measurement via light-matter interaction被引量：1
《Light(Science & Applications)》2022年第3期10-12,共3页Gianluca Ruffato 
The detection of orbital angular momentum usually relies on optical techniques,which modify the original beam to convert the information carried on its phase into a specific intensity distribution in output.Moreover,t...
关键词：BEAM OVERCOME INTERACTION 
Microsphere-assisted,nanospot,non-destructive metrology for semiconductor devices被引量：7
《Light(Science & Applications)》2022年第2期262-275,共14页Soonyang Kwon Jangryul Park Kwangrak Kim Yunje Cho Myungjun Lee 
This research was supported by Mechatronics Research,Samsung Electronics Co.,Ltd.
As smaller structures are being increasingly adopted in the semiconductor industry,the performance of memory and logic devices is being continuously improved with innovative 3D integration schemes as well as shrinking...
关键词：METROLOGY DIMENSION utilize 
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