POLISHING

作品数：210被引量：349H指数：10
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相关领域：金属学及工艺更多>>
相关作者：辛企明康仁科霍凤伟金洙吉赵福令更多>>
相关机构：大连理工大学东华大学北京理工大学南昌大学更多>>
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相关基金：国家自然科学基金国家重点基础研究发展计划广东省自然科学基金河北省自然科学基金更多>>
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Tailoring metallic surface properties induced by laser surface processing for industrial applications被引量：2
《Nanotechnology and Precision Engineering》2019年第1期29-34,共6页Guoqing Hu Yang Song Yingchun Guan 
National Key Research and Development Program of China under Grant 2018YFB1107700, 2018YFB1107400, and 2016YFB1102503;National Key Basic Research Program of China under Grant 2015CB059900;National Natural Science Foundation of China under Grant 51705013;Beijing Natural Science Foundation under Grant J170002
As a simple, reproducible, and pollution-free technique with the potential of integration and automation, laser processing has attracted increasing attention. Laser processing, which includes laser polishing, laser cl...
关键词：LASER PROCESSING LASER POLISHING LASER CLEANING SUPERHYDROPHOBICITY 
Composite Adaptive Control of Belt Polishing Force for Aero-engine Blade被引量：13
《Chinese Journal of Mechanical Engineering》2013年第5期988-996,共9页ZHsAO Pengbing SHI Yaoyao 
supported by National Natural Science Foundation of China(Grant No.51005184);National Science and Technology Major Project of Ministry of Science and Technology of China(Grant No.2009ZX04014-053)
The existing methods for blade polishing mainly focus on robot polishing and manual grinding.Due to the difficulty in high-precision control of the polishing force,the blade surface precision is very low in robot poli...
关键词：BLADE polishing force Bang-Bang control fuzzy neural network model reference adaptive control 
The impact of polishing on germanium-on-insulator substrates
《Journal of Semiconductors》2013年第8期38-42,共5页林旺 阮育娇 陈松岩 李成 赖虹凯 黄巍 
supported by the Key Program of the National Natural Science Foundation of China(Nos.61176050,61036003,61176092, 60837001;the Fundamental Research Funds for Fujian Province of China(No.2012H0038);the National Basic Research Program of China (Nos.2012CB933503,2013CB632103);the Fundamental Research Funds for the Central Universities,China(No.2010121056)
We prepared germanium-on-insulator（GOI） substrates by using Smart-CutTM and wafer bonding technology. The fabricated GOI is appropriate for polishing due to a strong bonding strength（2.4 MPa） and a sufficient bond...
关键词：germanium-on-insulator wafer bonding mechanical polishing chemical-mechanical polishing 
Origin of high oxide to nitride polishing selectivity of ceria-based slurry in the presence of picolinic acid
《Chinese Physics B》2011年第3期497-504,共8页王良咏 刘波 宋志棠 刘卫丽 封松林 黄丕成 S.V Babu 
supported by the Center for Advanced Materials Processing (CAMP) at Clarkson University;the National Integrate Circuit Research Program of China (Grant No. 2009ZX02023-3);the National Basic Research Program of China (GrantNos. 2007CB935400,2010CB934300 and 2006CB302700);the National High Technology Development Program of China (GrantNo. 2008AA031402);the Science and Technology Council of Shanghai,China (Grant Nos. 08DZ2200700,08JC1421700 and09QH1402600);the Chinese Academy of Sciences Visiting Professorship for Senior International Scientists
We report on the investigation of the origin of high oxide to nitride polishing selectivity of ceria-based slurry in the presence of picolinic acid. The oxide to nitride removal selectivity of the ceria slurry with pi...
关键词：chemical mechanical polishing CERIA oxide over nitride selectivity ORIGIN 
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