supported by the National Natural Science Foundation of China (Grant Nos. U20A6001, 11625207, 11902292, and 11921002);the Zhejiang Province Key Research and Development Project (Grant Nos.2019C05002, 2020C05004, and 2021C01183)。
Subsurface damage(SSD) is an unavoidable problem in the precision mechanical grinding for preparing ultra-thin and flexible silicon chips. At present, there are relatively few studies on the relationship between SSD a...
the National Natural Science Foundation of China(Grant Nos.51635007&51705180);Hubei Province Technology Innovation Special Projects(2017AAA002)
It is increasingly crucial for flexible electronics to efficiently and reliably peel large-area, ultra-thin flexible films off from rigid substrate serving as substrates of flexible electronics device, especially in i...
supported by the National Natural Science Fundation of China(Grant Nos.50825501,51321092&51335005);the National Science and Technology Major Project(Grant No.2008ZX02104-001)
We describe a direct atomic layer deposition method to grow lubricant tungsten disulfide (WS2) films. The WS2 films were deposited on a Si (100) substrate and a zinc sulfide (ZnS) film coated the Si (100) subs...
Supported by the Project of the State Key Basic Research and Development of China (Grant No. 2003CB716205)
The modified Reynolds equation for ultra-thin gas films between magnetic head; disk assembly is difficult to solve with conventional numerical methods, since the bearing number is very large; there exist boundary laye...